A, enhances the deformation resistance ability of the PCB circuit board PCB (
Deformation usually come from high temperature welding (back
Caused by the rapid heating and rapid cooling (
Heat bilges cold shrink)
, combined with the distribution of components on printed circuit board
s with copper foil, worsen the deformation of circuit board.
Way to increase the circuit resistance to deformation are: 1.
Increasing the thickness of PCB circuit boards.
If you can suggest to use one as much as possible.
More than 6 mm thickness of circuit board.
If you have to use 0.
2 mm thickness of the board, it is recommended to use a furnace fixtures to support and strengthen the board through the deformation of furnace.
Although you can try to reduce.
Use high Tg PCB material.
High Tg means high rigidity, but the price will go up, the necessary choice.
On the circuit board filled Epoxy adhesive (
Also can consider around the BGA or its corresponding circuit board on the back glue, to strengthen its ability to resist stress.
Around the BGA reinforced.
If there is a space, can be considered as in building a house, around the perimeter of the BGA call support on the iron box to strengthen its ability to resist stress.
BGA boards (
PCB circuit boards)
Second, to reduce the PCB deformation in general when the circuit board (
Is assembled to the cabinet should be protected by the chassis, after but because current product more do more thin, hand-held device, in particular, often produced during the bending force or drop impact of PCB deformation.
Want to reduce the external force on circuit board caused by the deformation, the method of any of the following: 1.
Strengthen the casing strength to prevent the deformation affects the internal circuit board.
In the printed circuit board add screws or fixed institutional around the BGA.
If we just protect the purpose of BGA, then can force agencies near fixed BGA, near to BGA is out of shape not easily.
Increase the buffer design of circuit board.
Some buffer material such as design, not only make the casing deformation, internal circuit board can still maintain is not affected by external stress.
But in life and have to consider taking the buffer.
Third, strengthen the security of BGA degree 1.
At the bottom of the BGA glue (
Increase amount of solder.
But it must be controlled in the case of can't short circuit.
Use the SMD (
Cover welding pad with green paint.
Increase the size of the BGA solder pads on printed circuit boards.
This will make it difficult to circuit board wiring, because the gap between the ball and the ball can go line becomes.
Use the Vias -
在- - - - - -
But the hole welding mat (
Will make plating fill holes, or return to weld there are air bubbles, but easy to cause the solder ball from the middle fracture.
It's like building a house call to pile is the same reason.
Individual is strongly recommended that, if it was already finished, you can use the best & lt;
Find out the stress concentration point circuit board.
If you have difficulty, also can consider to use the computer simulator for see where possible will stress concentration.
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