Cost factors of HDI PCB
In this article, we will introduce the cost and manufacturing best practices of HDI PCB, and the reasons for using HDI in some applications. HDI board has four main problems: HDI PCB material, layer and lamination, vias in HDI board, and optimal trace and space.
IC substrate technology Guide
IC Substrate represents the highest level of miniaturization in PCB manufacturing and has many similarities with semiconductor manufacturing. IC substrate acts as the connection between IC chip and PCB through a conductive network of wires and holes.