Item

Standard

Advanced

Item

Standard

Advanced

Max Layer Count

Rigid

64

68

Copper Weight

1/5oz - 10oz

1/7oz - 12oz

Flex

6

8

Hole(min)

Mechanical

200um

150um

Rigid-Flex

20

24

Laser

100um

100um

Thickness

Rigid

0.2mm - 10mm

0.1mm - 14mm

Vias' Pad

Mechanical

350um

300um

Flex

0.08mm - 0.8mm

0.06mm - 1.0mm

Laser

250um

200um

Size

Width

10.0mm - 800.0mm

3.0mm - 900.0mm(Multi800)

Hole Aspect Ratio

1:16

1:18

Length

10.0mm - 1500.0mm

3.0mm - 2100.0mm(Multi1320)

Min Deletric Thickness

Inner Core

0.025mm

0.025mm

Tracks

Width

70um

50um

Prepreg

0.05mm

0.05mm

Gap

70um

50um

HDI

3 + N + 3

4 + N + 3

Via Filling(with)

Soldermask/Resin/plating/copper & silver paste

Solder Mask Bridge

75um

60um

Embedded Passive

Capacitor

3M C-Ply, Dupont HK04J,Sammina (BC-2000), Mitsu Faradflex,OKA-Mitsui,Faradflex BC12M, BC24M
Dielectric thickness:12um,14um,25um
Capacitance/area:0.8nF/in2 - 10nF/in2
No license needed/Customization

Materials

Standard FR4,lead free compatible
High speed, low loss
Halogen free
High Frequency
Advanced microwave materials from Rogers/Arlon/Taconic,etc.
Special application material such as copper invar copper,customization etc.

Resistor

Resistance(ohms/sq):25,50,100,200;Ohmega-Ply,Asahi Tu-50/1000-08

Materials

Burried Copper/Ceramic/Coin/Steel/other metal/Components

Surface Treatment

Soft gold
Hard gold Flash Gold
OSP
ENIG
HAL
LF HAL
Immersion Tin
Immersion Silver
ENEPIG

Tolerance(+/-)

Hole

0.075mm

0.025mm

Slot

0.1mm

0.05mm

Tracks

15%

10%

Outline

0.1mm

0.08mm

Impedance

8%

5%

Dielectric

15um

10um

Depth Control

150um

100um

    Custom design files
    Contact