Item | Standard | Advanced | Item | Standard | Advanced | ||
Max Layer Count | Rigid | 64 | 68 | Copper Weight | 1/5oz - 10oz | 1/7oz - 12oz | |
Flex | 6 | 8 | Hole(min) | Mechanical | 200um | 150um | |
Rigid-Flex | 20 | 24 | Laser | 100um | 100um | ||
Thickness | Rigid | 0.2mm - 10mm | 0.1mm - 14mm | Vias' Pad | Mechanical | 350um | 300um |
Flex | 0.08mm - 0.8mm | 0.06mm - 1.0mm | Laser | 250um | 200um | ||
Size | Width | 10.0mm - 800.0mm | 3.0mm - 900.0mm(Multi800) | Hole Aspect Ratio | 1:16 | 1:18 | |
Length | 10.0mm - 1500.0mm | 3.0mm - 2100.0mm(Multi1320) | Min Deletric Thickness | Inner Core | 0.025mm | 0.025mm | |
Tracks | Width | 70um | 50um | Prepreg | 0.05mm | 0.05mm | |
Gap | 70um | 50um | HDI | 5 + N + 5 | 9 + N + 9 | ||
Via Filling(with) | Soldermask/Resin/plating/copper & silver paste | Solder Mask Bridge | 75um | 60um | |||
Embedded Passive | Capacitor | 3M C-Ply, Dupont HK04J,Sammina (BC-2000), Mitsu Faradflex,OKA-Mitsui,Faradflex BC12M, BC24M | Materials | Standard FR4,lead free compatible | |||
Resistor | Resistance(ohms/sq):25,50,100,200;Ohmega-Ply,Asahi Tu-50/1000-08, Ticer, Nichrome | ||||||
Materials | Burried Copper/Ceramic/Coin/Steel/other metal/Components | Surface Treatment | Soft gold | ||||
Tolerance(+/-) | Hole | 0.075mm | 0.025mm | ||||
Slot | 0.1mm | 0.05mm | |||||
Tracks | 15% | 10% | |||||
Outline | 0.1mm | 0.08mm | |||||
Impedance | 8% | 5% | |||||
Dielectric | 15um | 10um | |||||
Depth Control | 150um | 100um |
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