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SERVICES

 

Are you struggling to find a high-end PCB manufacturer? Are you suffering from the constant change of PCB suppliers due to their limited production capacity, quality and service. When you want to make PCB boards such as high multilayer PCB, HDI PCB, high frequency & high speed PCB, rigid-flex&flex PCB, thick copper, hybrid material, thermal management, metal core, backplane, embedded resistor &capacitor, IC substrate, ceramic base, wire bonding, special size and special requirements, entry barriers are the main problem you face. However, Rocket PCB can help you achieve all this.

FULL RANGE OF PCB PROTOTYPE

Advanced PCB prototype making and any type of PCB can be customized here. Low-cost fast turn under IPC-2. Includes high multilayer PCB, build-up HDI, HF material,

rigid-flex PCB, FPC, heavy copper, metal-core, gold finger, and so on. Read more

1. Layers: 1-64 Layers

2. Quantity: 1pcs-1000pcs

3. Quality: IPC 2

4. Build time: 2-15 days

5. Material: FR4, Flex, Rogers, Arlon, Taconic, etc.

ADVANCED PCB FABRICATION

Complex PCB fabrication solutions in HDI, high-frequency hybrid material, embedded components, multi-structure rigid-flex, stacked and staggered micro vias, fine line/space, back drilling, PTH&NPTH cavity, embedded copper coin, long-short, and staged gold finger. Read more

1. Layers: 1-64 Layers

2. Quantity: 1pcs-1million

3. Quality: IPC 2 & IPC-3

4. Build time: 2-20 days

5. Material: FR4, Flex, Rogers, Arlon, Taconic, etc.

PCB ASSEMBLY

Rocket PCB is capable of providing turn-key printed circuit board assembly services. 

Free DFM checking, custom testing, components sourcing. Meet one-stop fabrication and assembly. SMT, THT, Mixed Assembly, Package on Package (POP). Read more

1. Turnkey or consigned

1. Quantity: 1-10,000+pcs.

2. Quality Grade: IPC3
3. Lead time: as short as 2 days

4. Other: AOI. X-ray SPI, ICT

PCB SOLUTIONS

 

With our strong supply system and customer-focused service awareness, your PCB quick prototyping, standard manufacturing and complex PCB production become efficient and simple. Our vision is to provide satisfactory service and ensure that your costs are reduced. Rocket PCB provides comprehensive PCB engineering solutions and expertise to meet your needs and quality expectations, Our engineering services and techniques cover a wide range from 1 layer PCB to 64-layer PCB, from rigid PCB to flex PCB, from 1-step HDI to any-layer, from embedded materials to hybrid ones, from metal substrate to IC substrate, from backplanes to high speed frequency and RF, from standard materials to special materials, etc.

HDI PCB Solution
High Frequency PCB Solution
Rigid-flex PCB Solution
Thermal Management Solution
High Speed Backplane
Embedded Components
HDI PCB Fabrication Solution
HDI PCB Fabrication Solution
Rocket PCB has completed the accumulation of advanced PCB technology. At present, high-end PCB products are mainly HDI. HDI products are classified into first, second, third and fourth-order products, and the company's fourth-order product technology has been very mature, is the mainstream product in consumer electronics and other fields. Our company's long-term accumulation of advanced research and development technology and manufacturing technology, such as electroplating blind hole filling, laser direct drilling copper and build-up technology, makes itself occupy the technical advantage in the fierce market competition.
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High Frequency PCB Fabrication Solution
High Frequency PCB Fabrication Solution
High-frequency PCB needs special materials to realize the high-frequency signal provided by this type of printed circuit board. Many PCB designers choose Rogers dielectric material because of its lower dielectric and signal loss, lower circuit manufacturing cost and more suitable for rapid turnover prototype application. In addition to selecting the right PCB material and determining the correct Er value, the designer should also consider the conductor width and spacing, substrate constant, and other parameters. The highest level of process control must be used to specify and implement these parameters precisely. Rocket PCB is an experienced full-service PCB manufacturer, which can provide reliable and excellent high-frequency PCB fabrication services. Evaluate your requirements according to your design, rich variety of high-frequency materials, mature high-frequency PCB manufacturing experience.
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Rigid-flex PCB Fabrication Solution
Rigid-flex PCB Fabrication Solution
Rigid-flex PCB differs from rigid boards or flexible boards in material, equipment, and process. In terms of material, the material of the rigid board is FR4 of PCB, and the material of the flexible board is PI or PET. There are some problems between the two materials, such as joint, different shrinkage rate of hot pressing, etc. It is difficult for the stability of the product. Moreover, due to the characteristics of three-dimensional space configuration, besides the consideration of XY axis direction stress, Z-axis direction stress-bearing is also an important consideration. The structure is the most important factor in the design of rigid-flex. It is necessary to make the process simple and reliable and achieve the goal of low cost and applicability.
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Thermal Management PCB Fabrication Solution
Thermal Management PCB Fabrication Solution
To ensure reliability and efficiency of operation, heat must be removed from the power components that generate heat. Thermal management helps to elicit heat from the components of the heating system in a variety of application industries. Thermal management PCB provides a path for heat from the heat source to the outside or the inside medium. Heat sink PCBs can usually dissipate heat in three ways: conduction (Heat transfers from one solid to another), convection (Heat transfers from the solid to the moving fluid. For most power or LED applications, it would be transferred to air), radiation (Heat transfers from two objects with different surface temperature through thermal radiation). Rocket PCB offers a wide range of thermal management types including vias of farm heatsinks/pallets, heatsink coins, embedded coins, e-coins, Press Fit Coin (PFC), metal in-lay, solder or adhesive attach.  Additionally, Rocket's thermal management solutions include our patented embedded E-Coin technology, heatsink coin attac
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Backplane PCB Fabrication Solution
Backplane PCB Fabrication Solution
The manufacturing technology of backplane PCB with ultra-high-density and higher layers will be a direction of the future printed circuit board industry. The typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm. Its layer is already in the 16~28, this number is much higher than the ordinary PCB. In order to achieve such high performance requirements, PCB manufacturing must face the challenges of strict plate thickness, board size, number of layers, alignment control, back drilling depth and stub line. The core indicators of high-speed backplane PCB are signal integrity, namely impedance control, reflection and crosstalk. Therefore, the material of high-speed backplane PCB requires low loss factor enough to reduce signal transmission loss; Rocket PCB as China's leading PCB supplier, can process high speed and mixed backplane PCB custom service, can do 10G, 25G, 56G, automotive radar hybrid PCB board, sequential lamination, large format, N+N dual press-fit, dual-drill backplane.
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Embedded Components PCB Solution
Embedded Components PCB Solution
Embedded Components include embedded resistance and embedded capacitance. Passive components occupy a large part of surface real estate. Embedding these to internal layers reduces both PCB size and cost. Rocket PCB can provide high-density printed circuit board products with embedded passive components (thin core thickness less than 100 micron, embedded capacitance, resistance, inductance characteristics or integration of various embedded features). Embedded passive components must have a specified value, and the value must have a tolerance that allows PCB design to meet electrical timing and circuit signal quality. Embedded resistors or capacitors are included in PCB design, which can optimize the placement of passive components in the circuit. Rocket PCB usually uses embedded resistor materials, including cheaply, Shipley (insite), ticer (TCR). And embedded capacitor materials, including 3M (c-ply), oak-Mitsui (bc12tm), DuPont company (HK Series), senmina (BC-2000), ticer (TCC).
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PRODUCTS

Multilayer PCB
HDI PCB
Backplane PCB
RF&Microwave PCB
Hybrid PCB
Aluminum PCB
Embedded PCB
Cavity PCB
Flex PCB
Rigid-flex PCB
High density HDI PCB laser hole microvia PCB manufacturer PCB supplier
HDI PCB fabrication is the core manufacturing service of Rocket PCB, with various functions, qualifications, certification, and expertise to meet the most demanding requirements of HDI PCB fabrication. We support up to 40 laminates, laser drilling, micro via holes, stacked micro via holes, blind holes, buried through holes, via- in-pads, laser direct imaging, sequential lamination, any layer HDI. 00275 "trace/space, fine spacing as low as 3mil, controlled impedance, etc.
Custom Rigid-flex Printed Circuit Boards FPC PCB Manufacturer
✓   24-hour real-time technical support ✓   Quick turn around with 24 hours and instant quote  ✓   Effective and flexible PCB engineering solutions save your cost ✓   State-of-the-art PCB including rigid, FPC, rigid-flex, metal base, RF/microwave, hybrid, HDI, embedded, LED, backplane, a ceramic substrate, IC substrate ✓   Strong partnerships with different reputed material suppliers such as  Rogers, Arlon, Nelco, and Taconic can realize a fast service to a wide range of PCB applications ✓   Superb quality is guaranteed under the ISO9001, ISO14001, TS16949, OHSAS18001, ISO/IEC27001 system, insist on adopting 5S methods, Lean Six Sigma quality systems ✓  Complete service from free DFM, traceable manufacturing to complete after-sales service ✓  On-time delivery more than 99%

Why Choose Us

Rocket PCB is able to closely integrate manufacturing, logistics and PCB supply chain management. As a result, design, assembly and product distribution can be done faster at lower cost and without compromising our high-quality standards.  We always put the best interests first when providing innovative solutions for manufacturing customers’ products. 

 

Customer Focus

● 24-hour real-time technical support

● Quick turn-in 24H

● Quote in 2H

● Effective PCB engineering save cost

● Strong partnerships with reputed material

suppliers

● Free DFM  

● Traceable manufacturing  

● On-time delivery more than 99%

 

 

 

Top Capability

● 2mil line and space 

● 4mil laser defined vias

● Conductive and non-conductive via fill 

● Dual back drilling     

● Sequential lamination

● Mixed dielectric               

● Heavy copper/thermal vias

● Blind/buried vias & Stacked/staggered vias

● Multi-level cavity construction

● Plated cavities and edges

● Long-short and staged gold finger

● ... ...

High Quality

● IPC-2 

● IPC-3

● UL & ROHS

● ISO9001

● ISO14001

● Automotive IATF16949, Aeronautics AS9100,

Medical ISO13485, Communication TL9000,

and Health OHSAS18001       

● 5S methods & Lean Six Sigma 

● Extensive analytical  testing

 

 

Advanced Facility

● Laser direct imaging (LDI)

● Laser etching

● Laser forming

● VCP

● Automatic exposure

● Automatic placement 

● Character printer

● Vacuum lamination

● Appearance inspection machine

 

 

 

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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!