Rocket PCB has completed the accumulation of advanced PCB technology. At present, high-end PCB products are mainly HDI. HDI products are classified into first, second, third and fourth-order products, and the company's fourth-order product technology has been very mature, is the mainstream product in consumer electronics and other fields. Our company's long-term accumulation of advanced research and development technology and manufacturing technology, such as electroplating blind hole filling, laser direct drilling copper and build-up technology, makes itself occupy the technical advantage in the fierce market competition.

High-frequency PCB needs special materials to realize the high-frequency signal provided by this type of printed circuit board. Many PCB designers choose Rogers dielectric material because of its lower dielectric and signal loss, lower circuit manufacturing cost and more suitable for rapid turnover prototype application. In addition to selecting the right PCB material and determining the correct Er value, the designer should also consider the conductor width and spacing, substrate constant, and other parameters. The highest level of process control must be used to specify and implement these parameters precisely. Rocket PCB is an experienced full-service PCB manufacturer, which can provide reliable and excellent high-frequency PCB fabrication services. Evaluate your requirements according to your design, rich variety of high-frequency materials, mature high-frequency PCB manufacturing experience.

Rigid-flex PCB differs from rigid boards or flexible boards in material, equipment, and process. In terms of material, the material of the rigid board is FR4 of PCB, and the material of the flexible board is PI or PET. There are some problems between the two materials, such as joint, different shrinkage rate of hot pressing, etc. It is difficult for the stability of the product. Moreover, due to the characteristics of three-dimensional space configuration, besides the consideration of XY axis direction stress, Z-axis direction stress-bearing is also an important consideration. The structure is the most important factor in the design of rigid-flex. It is necessary to make the process simple and reliable and achieve the goal of low cost and applicability.

To ensure reliability and efficiency of operation, heat must be removed from the power components that generate heat. Thermal management helps to elicit heat from the components of the heating system in a variety of application industries. Thermal management PCB provides a path for heat from the heat source to the outside or the inside medium. Heat sink PCBs can usually dissipate heat in three ways: conduction (Heat transfers from one solid to another), convection (Heat transfers from the solid to the moving fluid. For most power or LED applications, it would be transferred to air), radiation (Heat transfers from two objects with different surface temperature through thermal radiation). Rocket PCB offers a wide range of thermal management types including vias of farm heatsinks/pallets, heatsink coins, embedded coins, e-coins, Press Fit Coin (PFC), metal in-lay, solder or adhesive attach.  Additionally, Rocket's thermal management solutions include our patented embedded E-Coin technology, heatsink coin attac

The manufacturing technology of backplane PCB with ultra-high-density and higher layers will be a direction of the future printed circuit board industry. The typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm. Its layer is already in the 16~28, this number is much higher than the ordinary PCB. In order to achieve such high performance requirements, PCB manufacturing must face the challenges of strict plate thickness, board size, number of layers, alignment control, back drilling depth and stub line. The core indicators of high-speed backplane PCB are signal integrity, namely impedance control, reflection and crosstalk. Therefore, the material of high-speed backplane PCB requires low loss factor enough to reduce signal transmission loss; Rocket PCB as China's leading PCB supplier, can process high speed and mixed backplane PCB custom service, can do 10G, 25G, 56G, automotive radar hybrid PCB board, sequential lamination, large format, N+N dual press-fit, dual-drill backplane.

Embedded Components include embedded resistance and embedded capacitance. Passive components occupy a large part of surface real estate. Embedding these to internal layers reduces both PCB size and cost. Rocket PCB can provide high-density printed circuit board products with embedded passive components (thin core thickness less than 100 micron, embedded capacitance, resistance, inductance characteristics or integration of various embedded features). Embedded passive components must have a specified value, and the value must have a tolerance that allows PCB design to meet electrical timing and circuit signal quality. Embedded resistors or capacitors are included in PCB design, which can optimize the placement of passive components in the circuit. Rocket PCB usually uses embedded resistor materials, including cheaply, Shipley (insite), ticer (TCR). And embedded capacitor materials, including 3M (c-ply), oak-Mitsui (bc12tm), DuPont company (HK Series), senmina (BC-2000), ticer (TCC).