Backplane PCB Fabrication Solution
The manufacturing technology of backplane PCB with ultra-high-density and higher layers will be a direction of the future printed circuit board industry. The typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm. Its layer is already in the 16~28, this number is much higher than the ordinary PCB. In order to achieve such high performance requirements, PCB manufacturing must face the challenges of strict plate thickness, board size, number of layers, alignment control, back drilling depth and stub line.
The core indicators of high-speed backplane PCB are signal integrity, namely impedance control, reflection and crosstalk. Therefore, the material of high-speed backplane PCB requires low loss factor enough to reduce signal transmission loss;
Rocket PCB as China's leading PCB supplier, can process high speed and mixed backplane PCB custom service, can do 10G, 25G, 56G, automotive radar hybrid PCB board, sequential lamination, large format, N+N dual press-fit, dual-drill backplane.