INFO CENTER

After 18 years of continuous development, the exhibition was formerly known as "international circuit board and electronic assembly South China Exhibition". The one-stop exhibition covers the whole supply chain of circuit board and electronic assembly industry with innovative equipment and technology, and is the leading business and communication platform in the PCB industry.

HDI is actually a kind of PCB technology. HDI, that is high-density interconnection technology. HDI board is the consistent name of Japanese enterprises for high-density interconnection printed circuit board, while in Europe and America, HDI board is called

Nowadays, high density interconnect (HDI) printed circuit board is widely used. Traditional HDI circuit board is used in portable products and semiconductor packaging products. This paper will focus on the third type of application of HDI: high-speed industrial system application, which is used in telecommunication and computer systems. The difference between these two types of PCB lies in the large size of PCB, the focus on electrical performance, and the challenge of conductor lies in the very complex packaging of PBGA and CCGA.

With the increasing demand for the volume of information products, especially the development of mobile device products in the direction of continuous miniaturization, such as the current popular ultra book products, even new wearable intelligent devices, must use HDI high-density interconnection technology to make the carrier board, and further reduce the size of the terminal design.

As the leader of A-share PCB, Avary holdings released its semi annual report on August 13, which showed that due to the Sino US trade war and the shrinking demand for downstream electronic products, its main business decreased slightly but remained stable, with a year-on-year increase in net profit of about 40%.

HDI is the abbreviation of high density interconnector, it is a kind of technology to produce printed circuit board. It is a circuit board with high distribution density using micro blind and buried hole technology.