Overview of IPC standard directory-PCB fabrication
What is IPC
After the Second World War, the production of printed boards in the United States developed further.
1957- In September, six PCB enterprises established the "Institute of printed circuits" (IPC).
1977-It was renamed the Institute for interconnection and packaging electronic circuits
1998- It was renamed Association connecting electronics industries
The purpose of IPC is to serve the PCB and electronic assembly industry and its users and suppliers. IPC's activities mainly include: Market Research and statistics, standards and specifications, technical seminars, workshops, qualification training and certification, printed circuit exhibition, etc. Among them, it is particularly prominent to formulate the standards and specifications for the manufacture and assembly of printed circuit boards.
As of May 2000, IPC has 2643 members, including about 36% of PCB manufacturers and EMS suppliers, about 25% of OEM manufacturers (about 32%) and government agencies, schools and research institutes. Among them, North America (the United States and Canada) accounted for 79%, Asia 12%, Europe 8%, and other places 1%
IPC standard
The IPC technical committee adopts an open policy and absorbs the staff of member units to participate in the sub committees and working groups under the IPC Technical Committee.
A sub committee or working group of the IPC is responsible for a standard and meets from time to time in addition to separate activities during the IPC spring and autumn meetings each year. Therefore, many standards and specifications need to be issued or revised every year. The numbering method of IPC standard is IPC with subject word letters and two or three digit numbers. For example, IPC-D-275, where d stands for design and the number is 275.
Since 1995, IPC standard began to adopt a new numbering method. After the code IPC, the letters of subject words were cancelled and numbered directly with four digits, and the numbers were arranged according to the standard series.
Up to now, IPC has formed several new series of standards, including
IPC-2220 design series, IPC-4100 material series, IPC-6010 PCB performance series, etc;
IPC-2221 general standard; IPC-4101 rigid substrate, IPC-4101 HDI and micro through hole
IPC-2222 rigid printed board; IPC-6011 general specification for printed board; IPC-6012 rigid printed board;
IPC-2223 flexible printed board; IPC-4110 fiber paper; IPC-6013 flexible printed board
IPC-2224 PC card; IPC-4130 glass nonwoven fabric; IPC-6015 MCM-L;
IPC-6016 HDI PCB; IPC-6018 Microwave PCB: IPC other technical documents;
IPC standard and other printed circuit standards
IPC is the printed circuit industry organization in the United States. Due to years of efforts, IPC not only has a high status in the United States, but also has a great influence in the international community.
Most of its standards have been adopted as ANSl standards, and some have been approved by the U. S. Department of defense to replace the corresponding mil standards. For example, IPC-D-275 replaces MIL-STD-275, IPC-4101 replaces MIL-S-13949 test methods used in MIL-P-55110 general specification for printed circuit boards, and most of them directly refer to IPC-TM-650 manual
Internationally, it is one of the organizers of the world electronic circuit Conference (WECC). It has close ties with other international organizations and industry organizations in other countries.
5 major standards of IPC in electronics industry
1. IPC-A-610E (acceptability requirements for electronic components)
2. J-STD-001D (soldering requirements for electrical and electronic components)
3. IPC-7711 / 21 (rework & repair of electronic components and circuit boards)
4. IPC-A-600H (acceptance conditions for printed boards)
5. IPC-A-620A (technical conditions and acceptance requirements for cable and harness assembly)
IPC-A-610E (acceptability requirements for electronic components)
IPC-A-610 is a standard for the acceptability of printed circuit board assemblies, which is the most widely used inspection standard in the electronic industry. Internationally, this standard is used to standardize the acceptable level and high reliability circuit board components of the final product.
IPC-A-610 is generally recognized by the electronic manufacturing industry in the world, and can be used as the internationally accepted quality inspection standard.
IPC-A-610 specifies how to assemble components to PCB. It provides measurable component position and solder joint size for each level of standard, and provides corresponding technical indicators of qualified solder joint
IPC J-STD-001E (soldering requirements for electrical and electronic components)
Promoting understanding and acquiring practical soldering skills has become the authoritative manual of global electronic assembly manufacturing industry. This standard describes the materials, methods and audit requirements for the manufacture of high quality lead-free and lead-free interconnect components. It emphasizes process control and sets industry wide requirements for all aspects of electronic connectivity.
IPC-7711 / 21 (rework & repair of electronic components and circuit boards)
How to minimize waste?How to repair electronic components to reduce costs?
Many manufacturers and assembly engineers hope to save a lot of manufacturing costs by rework electronic components and PCB boards. Naturally, they see the value of IPC-7711 / 21. This standard, which is widely used by the industry, provides common skills for through hole, surface mount rework, connection plate, conductor and laminate rework. It contains tools, materials and methods and procedure requirements for removing and modifying coatings, surface mount and through-hole components. This standard also describes the specification requirements for repair and modification of circuit boards and components. In addition, the standard also adds repair guidance for lead-free, BGAs and flexible circuit boards
IPC-A-600H (acceptance conditions for printed boards)
IPC-A-600 establishes the acceptance specification for the ideal, acceptable and rejected conditions on the bare PCB, so as to set the standard for the process quality of PCB. With the help of this standard, PCB fabrication personnel and assembly personnel have a deeper understanding of PCB quality inspection, and enhance their communication with suppliers and customers. Therefore, IPC-A-600 has become one of the most widely used standards.
IPC-A620A (technical conditions and acceptance requirements for cable and harness assembly)
IPC / WHMA-A-620A has been widely accepted by the international industry since it was first published in 2002, and soon became the most important guiding standard for the process, material and inspection management of cable harness industry. With the support of whma Industrial Technology Steering Committee, IPC / NHMA-A-620 standards and certification courses have been translated into many languages. As the acceptance standard of terminal products, it has been widely recognized internationally. At present, IPC / WHMA-A-620 is widely adopted by OEM and EMS companies all over the world.
IPC Document Revision Table
IPC DOC＃ | Title | Revision Date |
Roadmap | International electronic interconnection technology | 95. 6 |
SMC-TR-001 | SMT Introduction to tape automated bonding&Fine pitch technology | 89. 1 |
J-STD-001 | Technical requirements for soldered electrical and electronic components | 96. 10 (latest) |
IPC-HDBK-001 | Technical manual and guide for soldered electrical and electronic assemblies requirements | 98. 3 |
J-STD-002 | Solderability testing of component leads, terminals, terminals and conductors | 92. 4 |
J-STD-003 | Solderability test of printed circuit board | 92. 4 |
J-STD-004 | Technical requirements for fluxes | 96. 4 |
J-STD-005 | Technical requirements for solder paste | 95. 1 |
J-STD-006 | Technical requirements for fluxed and unfixed solid solder for electronic solder alloys and electronic soldering applications | 96. 6 |
J-STD-012 | Implementation procedures of flip chip and chip scale technology | 96. 1 |
J-STD-013 | Implementation procedures for ball grid array and other high density technologies | 96. 7 |
IPC-DRM-18 | Component qualification reference manual | 98. 7 |
J-STD-020 | Humidity / Reflow Sensitivity Classification of plastic surface mount devices | 99. 3 |
IPC-DRM-40 | Through hole solder joint evaluation reference manual | |
IPC-TRM-SMT | Surface mount solder joint evaluation reference manual | 98. 8 |
IPC-T-50 | Terms and definitions for interconnection and packaging of electronic circuits | 96. 6(F) |
IPC-SC-60 | Post solder solvent cleaning manual | 87. 7 |
IPC-SA-61 | Post-Solder Semi-Aqueous Cleaning Handbook | 95. 7 |
IPC-AC-62 | Post solder water cleaning manual | 86. 12 |
IPC-CH-65 | Cleaning criteria for printed circuit boards and components | 90. 12 |
IPC-CS-70 | Safety criteria for compound operation in printed circuit board manufacturing | 88. 8 |
IPC-CM-78 | Surface mount and interconnect chip carrier criteria | 83. 11 |
IPC-MP-83 | IPC metric method | 85. 8 |
IPC-PC-90 | General technical specification for implementing statistical process control | 90. 10 |
IPC-Q-95 | General technical specification for implementing ISO 9000 quality system | 93. 4 |
IPC-L-108 | Technical specification for thin layer metal clad substrate materials for multilayer printed circuit boards | 90. 6 |
IPC-L-109 | Technical specification for impregnated fiber epoxy resin for multilayer printed boards | 92. 7 |
IPC-L-110 | Prepreg, grade B epoxy glass cloth for multilayer printed circuit boards | Voided |
IPC-CC-110 | Guide for selecting core structure for multilayer printed circuit boards | 97. 12 |
IPC-L-112 | Technical specification for clad composite metal matrix material of printed circuit board | 92. 6 |
IPC-L-115 | Technical specification for rigid metal clad substrate materials for printed circuit boards | 90. 4 |
IPC-L-120 | Inspection procedure of chemical treatment of copper lined epoxy glass | Voided |
IPC-L-125 | Technical specification for coated or uncoated plastic substrates for high speed / high frequency interconnection | 92. 7 |
IPC-L-130 | Technical specification for thin-layer pressing plate and covering metal for general purpose multilayer printed circuit board | Replaced by IPC108 |
IPC-EG-140 | Technical specification for fiber textiles made of "e" glass for printed circuit boards | 97. 6 |
IPC-SG-141 | Technical specification for fiber textiles made of "s" glass for printed circuit boards | 92. 2 |
IPC-A-142 | Technical specification for fiber textiles made of aramid glass for printed circuit boards | 90. 6 |
IPC DOC＃ | Title | Revision Date |
IPC-QF-143 | General technical specification for fiber textiles made of quartz for printed circuit boards | 92. 2 |
IPC-CF-148 | Epoxy coated metal for printed boards | 98. 9 |
IPC-MF-150 | Metal foil for printed wiring | 92. 8 |
IPC-CF-152 | Technical specification for composite metal materials for printed circuit boards | 98. 3 |
IPC-FC-203 | Technical specification for flat cable, circular conductor and grounding ground | 85. 7 |
IPC-FC-210 | Technical specification for performance of underground cables with flat connectors | 85. 9 |
IPC-FC-213 | Technical specification for flat underground telephone cables | 84. 9 |
IPC-FC-217 | Voided | |
IPC-FC-218B | General technical specification for types of connectors and electrical flat cables | 91. 5 |
IPC-FC-219 | Flat cable connector for aviation in sealed environment | 84. 5 |
IPC-FC-220 | Technical specification for unshielded flat cable and flat connector | 85. 7 |
IPC-FC-221 | Technical specification for flat copper conductors for flat cables | 84. 5 |
IPC-FC-222 | Technical specification for circular conductor of unshielded flat cable | 91. 5 |
IPC-FC-225 | Flat cable design guide | 85. 10 |
IPC-FC-231 | Flexible matrix insulating materials for flexible printed circuits | 95. 10 |
IPC-FC-232 | It is used for coating adhesive on flexible printed circuit and flexible connection film covering board | 95. 10 |
IPC-FC-233 | Reference 232 | |
IPC-FC-241 | Flexible sheathed metal insulating materials for flexible printed circuits | 95. 10 |
IPC-RF-245 | Performance Specification for rigid flexible printed circuit boards | 87. 4 |
IPC-D-249 | Design standard for single and double sided flexible printed circuit boards | 87. 1 |
IPC-FC-250A | Technical specification for single and double sided flexible printed circuit | 86. 9 |
IPC-FA-251 | Guide for single and double sided flexible circuits | 92. 2 |
IPC-D-275 | Design standard for rigid printed circuit boards and rigid printed circuit board assemblies | 96. 4 |
IPC-RB-276 | Specification and Performance Specification for rigid printed circuit boards | 92. 3 |
IPC-D-279 | Reliable surface mount technology design guide for printed circuit board assemblies | 96. 7 |
IPC-D-300 | Printed circuit board dimensions and tolerances | 84. 1 |
IPC-D-310 | Technical guide for generation and measurement of photographic tools | 91. 6 |
IPC-A-311 | Process control guide for generation and use of photographic tools | 96. 3 |
IPC-D-316 | Design Guide for microwave circuit board using soft substrate | 95. 5 |
IPC-D-317 | Design Guide for electronic packaging using high speed technology | 95. 1 |
IPC-HF-318 | Inspection and test of circuit board for microwave terminal products | 91. 12 |
IPC-D-319 | Design standard for rigid single and double sided printed circuit boards | 87. 1 |
IPC-D-320A | Standard for printed circuit boards, rigid, single and double sided, terminal products | 81. 3 |
IPC-SD-320B | Performance Specification for rigid single and double sided printed circuit boards | 86. 11 |
IPC-D-322 | Guide for selecting printed circuit board size by reference to standard board size | 91. 9 |
IPC-MC-324 | Performance Specification for metal core circuit boards | 88. 10 |
IPC-D-325 | Technical requirements for printed circuit boards, assemblies and supporting drawings | 95. 5 |
IPC-D-326 | Technical requirements for manufacturing printed circuit board components | 91. 4 |
IPC-D-330 | Design Guide Manual | |
IPC-PD-335 | Electronic package manual | 89. 12 |
IPC DOC＃ | Title | Date of publication |
IPC-NC-349 | Digital control format of router | 85. 8 |
IPC-D-350 | Digital description of printed circuit board | 92. 7 |
IPC-D-351 | Digital description of printed circuit board diagram | 85. 8 |
IPC-D-352 | Description of electronic design data for digital pair printed circuit board | 85. 8 |
IPC-D-354 | Format description of digital printed circuit board Library | 87. 2 |
IPC-D-355 | Digital description of PCB assembly | 95. 1 |
IPC-D-356 | The form of bare digital test data | 98. 1 |
IPC-AM-361 | Technical specification for rigid substrates for process printed circuit boards | 82. 1 (void) |
IPC-MB-380 | Guide to molded interconnect devices | 90. 10 |
IPC-D-390 | Automatic design guide | 88. 2 |
IPC-C-406 | Design and Application guide for Surface Mount Connectors | 90. 1 |
IPC-CI-408 | Design and Application guide for non soldered surface mount connectors | 94. 1 |
IPC-BP-421 | General technical specification for press fit rigid printed circuit board base plates | 90. 4 |
IPC-D-422 | Design Guide for press fit rigid printed circuit board backplane | 82. 9 |
IPC-DW-424 | General technical specification for sealed discrete wire interconnection circuit boards | 95. 1 |
IPC-DW-425 | Design of discrete circuit board and technical requirements of terminal products | 90. 5 |
IPC-DW-426 | Technical specification for discrete circuit assembly | 87. 12 |
IPC-TR-460 | Fault detection table for wave soldering of printed circuit board | 84. 2 |
IPC-TR-461 | Solderability evaluation of thick and thin coatings | 79. 3 |
IPC-TR-462 | Solderability evaluation of printed circuit boards coated with protective coatings for long-term preservation | 87. 10 |
IPC-TR-464 | Accelerated aging for solderability evaluation | 87. 12 |
IPC-TR-465-1 | Cycle test on temperature control stability of steam aging | 93 |
IPC-TR-465-2 | Influence of steam aging time and temperature on solderability test results | 93 |
IPC-TR-465-3 | Evaluation on steam aging of alternative coating | 96. 7 |
IPC-TR-466 | Wetting balance standard weight comparison test | 95. 4 |
IPC-TR-467 | Examples of supporting data and figures in Appendix D of ANSI / j-std-001 | 96. 10 |
IPC-TR-468 | Factors affecting insulation resistance of printed circuit board | 79. 3 |
IPC-TR-470 | Thermal characteristics of multilayer interconnect circuit boards | 74. 1 |
IPC-TR-474 | A survey of separate line technology | 79. 3 |
IPC-TR-476 | How to avoid metal expansion in electronic hardware | 74. 1 |
IPC-TR-480 | Results of multi level IV cycle test program phase I | 75. 9 |
IPC-TR-481 | Results of multi-layer V-cycle test program | 81. 4 |
IPC-TR-483 | International cycle test procedure for dimensional stability testing of thin laminates | 86. 4 |
IPC-TR-484 | Results of ductility cycle study on IPC copper foil | 86. 4 |
IPC-TR-485 | Research results of brittle strength test cycle of IPC copper foil | 85. 3 |
IPC-TR-549 | Spots on printed circuit boards | 73. 11 |
IPC-TR-551 | Quality evaluation of assembly and interconnection of printed circuit board electronic components | 93. 7 |
IPC-DR-570 | General specification for 1 / 8 inch diameter cemented carbide bit printed boards | 84. 4 |
IPC-DR-572 | Drilling guide for printed circuit board | 88. 4 |
IPC-TR-576 | Process evaluation | 77. 9 |
IPC DOC＃ | Title | Date of publication |
IPC-TR-578 | Lead edge manufacturing technical report | 84. 9 |
IPC-TR-579 | Cycle reliability evaluation of small diameter plating shoe through hole in printed circuit board | 88. 9 |
IPC-TR-580 | Cleaning and cleanliness test procedure phase 1 test results | 89. 10 |
IPC-TR-581 | Research on IPC third stage controlled atmosphere soldering | 94. 8 |
IPC-TR-582 | Study on the no clean flux for IPC stage 3 | 94. 11 |
IPC-A-600 | Acceptability of printed circuit board (inspection standard) | 95. 8 |
IPC-QE-605A | Printed circuit board quality evaluation manual | 99. 2 |
IPC-SS-605 | Quality evaluation of printed circuit board | |
IPC-A-610 | Inspection standards for electronic components | 95. 8 |
IPC-QE-615 | Assembly quality assessment manual | 93. 3 |
IPC-SS-615 | Assembly quality assessment | 93. 3 |
IPC-AI-640 | User's Guide for automatic detection of thick film mixed substrates without component placement | 87. 1 |
IPC-AI-641 | User's Guide for automatic solder joint inspection | 87. 1 |
IPC-AI-642 | User's Guide for PWB automatic detection of schematic, inner and unmounted components | 88. 10 |
IPC-OI-645 | Standard for optical testing instruments | 93. 10 |
IPC-TM-650 | Test method manual | |
IPC-ET-652 | Electrical test rules and technical requirements for printed circuit boards without components attached | 90. 10 |
IPC-QL-653 | Equipment qualification for inspection / test of printed circuit boards, components and materials | 97. 11 |
IPC-MI-660 | Inspection Manual of raw materials | 84. 2 |
IPC-R-700C | Guide for modification, rework, and rework of printed circuit boards and assemblies | 88. 1 |
IPC-TA-720 | Laminate technology assessment manual | |
IPC-TA-721 | Technical evaluation manual for multilayer circuit board | |
IPC-TA-722 | Soldering technology assessment | |
IPC-TA-723 | Evaluation Manual of surface assembly technology | |
IPC-TA-724 | Technical evaluation of purification room | |
IPC-PE-740 | Guide for fault detection of printed circuit board manufacturing and assembly | 97. 12 |
IPC-CM-770 | PCB component mounting | 96. 1 |
IPC-SM-780 | Packaging and interconnection of surface mount components | 88. 3 |
IPC-SM-782 | Surface assembly design and pad graphics standard | 96. 10 |
IPC-EM-782 | Surface assembly design and pad distribution | 95. 12 |
IPC-SM-784 | Cob Technology Application Guide | 90. 11 |
IPC-SM-785 | Guide for rapid reliability testing of surface mount solder joints | 92. 11 |
IPC-SM-786 | Characterization and treatment of ICs in humid atmosphere / re influenza | 95. 1 |
IPC-MC-790 | Application guide of multi chip module technology | 92. 8 |
IPC-S-804 | Solderability test method of printed circuit board | 87. 1 |
IPC-S-805 | Solderability testing of component leads and terminals | 85. 1 |
IPC-MS-810 | A guide to high volume microsheets | 93. 10 |
IPC-S-815 | General technical requirements for soldered electronic interconnectors | 87. 12 |
IPC-S-816 | SMT process guide and checklist | 93. 7 |
IPC-SM-817 | General technical requirements for insulation surface mounting adhesive | 89. 11 |
IPC-SF-818 | General technical requirements for fluxes used in electronic component soldering | 91. 12 |
IPC DOC＃ | Title | Date of publication |
IPC-SP-819 | General technical requirements and test methods for solder paste used in electronic industry | 88. 10 |
IPC-AJ-820 | Assembly and connection manual | 96. 8 |
IPC-CA-821 | General technical requirements for thermal conductive adhesives | 95. 1 |
IPC-CC-830 | Identification and performance of electronic insulating compounds for printed circuit board assemblies | 98. 10 |
IPC-SM-839 | Guidelines for cleaning before and after solder mask application | 90. 4 |
IPC-SM-840 | Identification and properties of permanent polymer coatings for printed circuit boards | 96. 1 |
IPC-H-855 | Hybrid microcircuit Design Guide | 82. 10 |
IPC-D-859 | Design standard for thick film multilayer hybrid circuits | 89. 12 |
IPC-HM-860 | Technical specification for Multilayer Hybrid Circuits | 87. 1 |
IPC-TF-870 | Identification and performance of polymer thick film printed circuit boards | 89. 11 |
IPC-ML-910 | Replaced by 275 | |
IPC-D-949 | Design standard for rigid multilayer printed circuit boards | 87. 1 |
IPC-ML:-950 | Performance Specification for rigid multilayer printed circuit boards | 86. 11 |
IPC-ML-960 | Specification for qualification and performance of bulk laminates for multilayer printed circuit boards | 94. 7 |
IPC-ML-975 | Technical specification for terminal products for multilayer printed circuit boards | 69. 9 |
IPC-ML-990 | Technical specification for multilayer flexible transmission lines | 72. 9 |
IPC-1402 | Hybrid microcircuit Design Guide | 82. 10 |
IPC-1710 | OEM standard for mqp of printed circuit board manufacturer | 97. 12 |
IPC-1720 | Assembly qualification curve (AQP) | 96. 7 |
IPC-1730 | Glue machine identification curve (LQP) | 98. 1 |
IPC-2141 | Controllable impedance circuit board and high speed logic design | 90. 4 |
IPC-2221 | General standard for printed circuit boards | 98. 2 |
IPC-2222 | Design standard for rigid organic printed circuit board | 98. 2 |
IPC-2223 | Sectional design standard for flexible printed circuit boards | 98. 11 |
IPC-3406 | Rules for conductive adhesives for surface assembly | 96. 7 |
IPC-3408 | General technical requirements for anisotropic conductive adhesive films | 96. 11 |
IPC-4101 | Technical specification for matrix materials of rigid and multilayer printed boards | 97. 12 |
IPC-4110 | Specification and characterization of cellulose paper for printed circuit board nonwoven fabrics | 98. 8 |
IPC-4130 | Technical specification and characterization method of nonwoven "e" fiberglass board | 98. 9 |
IPC-6011 | General performance specification for printed circuit boards | 96. 7 |
IPC-6012 | Technical specification for identification and performance of rigid printed circuit boards | 96. 7 |
IPC-6013 | Technical specification for qualification and performance of flexible printed circuit boards | 98. 11 |
IPC-6015 | Specification for identification and performance of mcm-l assembly and interconnection structures | 98. 2 |
IPC-6018 | Inspection and test of circuit board for microwave terminal products | 98. 1 |
IPC/JPCA-6202 | Performance guide for single and double sided flexible printed circuit boards | 99. 2 |
IPC-7711 | Repair of electronic components | 98. 4 |
IPC-7721 | Repair and modification of printed circuit board and electronic components | 98. 4 |
IPC-9201 | Surface insulation resistance manual | 96. 7 |
IPC-9501 | Evaluation of PWB simulation assembly process for electronic components | 95. 7 |
