Embedded PCB

Small mobile devices with a large number of passive components require installations of higher density. Unfortunately, the surface mounting area of traditional surface mount technology (two-dimensional implementation) cannot support these components. This is why the three-dimensional implementation using the embedded PCB technology is proposed.
Rocket PCB has independently developed a connection process adopting laser through holes and electroplating and has the record of mass production of both processes.

Total: 1 page
Contact