Rocket PCB specializes in solving complex PCB applications. It has strong experience in high-difficulty PCB processing, such as RF line control, high-frequency, high-speed, multi-drill and large-size backplane, micro-via, plating over for via（POFV）, buried resistance and capacitor, high-order and multi-stage HDI, dual press-fit, dual-drill, embedded copper coin, press-fit coin, multi-cavity, metal core bonding, special gold finger, heat dissipation solutions, etc. These special processes put forward high requirements on plant equipment, technical ability, personnel skills, R&D investment, processing control, project evaluation and so on. This is not a common PCB factory can achieve alone. In Rocket PCB, which has been deposited in these professional fields for many years, is able to solve all these problems, occupy a higher level of complex PCB production. More details about printed circuit board, click this link in.
We are here to help you! If you close the chatbox, you will automatically receive a response from us via email. Please be sure to leave your contact details so that we can better assist