Details as 5 g, Internet and other applications will use the higher frequency, from the past 3 GHZ to 6 GHZ 2 - even
30 GHZ, this will bring 5 g antenna rf material new technology trends.
Below is about how to choose the PCB material and its application in 5 g some to discuss the influence of different frequency bands: if it is 24 GHZ power amplifier, it is recommended to use what material?
First consider Rogers RO4350B/RO4835 material and its LoPro version, if the performance is not enough, please consider upgrading loss smaller panels, such as RO3003 etc.
What kind of substrate material is more suitable for the future of 5 g millimeter wave antenna?
5 g antenna plate (
PCB circuit boards)
Can focus on RO4730G3 material, this is the patent of hydrocarbons hollow silicon ball filler resin system, with excellent electrical, mechanical and thermal properties.
RO4450T ™ and RO4450B ™ and what is the difference between them?
On the one hand, the thickness is different, have 3 mil RO4450T material, 4 mil, the choice of 5 mil, and only 4 mil RO4450B material, on the other hand, there is a slight change and upgrade rmula, such as better liquidity.
Material properties is TCDk limit?
Can you explain TCDk?
TCDk is material to the temperature coefficient of dielectric constant, namely Dk dielectric constant becomes much under high temperature and low temperature, it will impact on the performance of product design under the high or low temperatures.
For example, used for microstrip bandpass filter.
In general, the use of RA, RQ or RZ, the roughness of the copper foil more accurate as standard.
Copper foil roughness have different definitions, is closely related to the performance, such as root mean square value loss called RQ, other RA, RZ are usually made of copper foil supplier parameters is given.
Can you recommend suitable for above 100 GHZ or PCB material?
Please refer to the RO3003 materials, DiClad880 materials, RT/duroid5880 materials low-loss high-frequency pieces, etc.
What material used for 60 - recommend
70GHz？
Also according to your specific application scenarios and indicators to determine.
In general, can prioritize RO4350B/RO4835 and LoPro version material, and then use smaller dielectric constant of the panel (RO3003 material loss
Process)
And the dielectric constant (
Design)
What is the difference between?
Under the different measuring methods, it is a different result, including DesignDk is used for the parameters of the simulation and actual circuit design.
LoPro technology will affect the accuracy of the etching line?
Compared with ordinary electrolytic copper foil, LoPro copper foil is smooth, help to fine circuit etch.
Use different forms of microstrip line, stripline and coplanar waveguide, Dk is used in the specification and the actual situation is different?
Dk Dkonthe specification is usually refers to the media.
In different circuit structure, the electromagnetic field distribution and the equivalent circuit of Dk is different.
Rogers in the design specification, Dk value based on the structure of microstrip line.
How do you ensure that PCB PCB laminate under different humidity environment performance?
Our unit in relatively large environmental humidity, often meet with the performance of the winter and the rainy day there are some differences.
Hygroscopicity is an important index of PCB material.
In the parameters of the material has bibulous rate.
Value as small as possible.
Test method for 23 degrees under water 24 hours a day and 48 hours 50 degrees under water.
In addition, for sheet, double 85 test may be even more demanding.
Less than 6 GHZ, dielectric constant is usually 3 to 3.
7.
Select the major effect of the dielectric constant is?
When designing the SIW filter, in order to reduce the size, can choose bigger permittivity, such as RT/duroid601010.
2 lm material?
Dielectric constant of difference can cause to the line width of the difference, this will affect the line insertion loss.
For antenna applications, dielectric constant and indirect effect on the efficiency of antenna gain.
Using materials with high dielectric constant is the commonly used method to decrease the size of the circuit.
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