Before appears in the printed circuit board
, electronic components of interconnection between relied on wires connected directly and form a complete circuit.
In the contemporary, circuit board to exist as an effective experiment tool only, and printed circuit board in the electronics industry has become the dominant position.
At the beginning of the 20th century, people in order to simplify the production of electronic machine, reduce the wiring between the electronic components, reduce the production cost advantages, and began to study in the printing way instead of the wiring method.
Thirty years, constantly have engineers in insulating substrate to metal conductor wiring.
But in 1925, is the most successful American CharlesDucas in insulating substrate printed circuit design, again by electroplating, successfully established a conductor wiring.
Until 1936, Austrian Paul le (love
Published a foil membrane technology in the UK, he adopted the printed circuit board in a radio device;
In Japan, palace this pleased help spray-up wiring method 'メ タ リ コ ン blowing wiring method (
'Successful apply for a patent.
And of the two PaulEisler method and printed circuit board is most similar to today, this kind of practice is called subtractive method, is to remove unwanted metal;
And the practice of CharlesDucas, palace this pleased help is only with the required wiring, called addition process.
Even so, but because the electronic components calorific value is big, the substrate is also difficult to cooperate to use, so that no formal and practical, but also make printed circuit technology further.
Double module development of PCB circuit board
s: in recent years, China's printed circuit board (
Manufacturing industry development is rapid, output value, the total output of both the world's first.
Due to the electronic products, the price war changed the structure of the supply chain, China's industry distribution, cost and market advantage, has become the world's most important production base of printed circuit board.
Printed circuit board from single to double-sided multi-layer circuit boards and flexible circuit boards, PCB board, and continuously to develop in the direction of high precision, high density and high reliability.
The shrinking volume, reduce costs, improve performance, the printed circuit board in the process of the development of electronic products in the future, still keep strong vitality.
Future printed circuit board manufacturing technology is development trend in performance to high density, high precision, fine pore diameter and thin wire, small spacing, high reliability, multiple stratification, high-speed transmission, light weight, thin direction.
Whether it's automation or artificial intelligence, the rapid convergence of technology and business often determines pcb making service’s competitiveness.
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