Dongguan Rocket PCB circuit technology co. , LTD. , after years of PCB production process are summarized some production experience, especially for some of the multilayer
PCB circuit board production, especially for the line width from line 3 mil, 3.
5 mil board, the circuit etch, graphic transfer request is very high, not just for the equipment, but also to the need of human experience is very high, the so-called 'fire makes sweet malt', high-quality goods is need time to forge!
For PCB, multilayer circuit boards its wiring is very precise, and a lot of
PCB manufacturers are using dry film process, the shift in line graphics, but in the process of production, a lot of PCB manufacturers produce many pitfalls when using dry film, dongguan Rocket PCB factory relevant experience is summarized, supply the reference for friends to learn, welcome everybody to give directions, communicate!
When a dry film on the mask, circuit board production hole in the broken hole a lot of customers the wrong feel, after a broken hole, should increase the paster temperature, and pressure, in order to enhance its binding force, but the idea that is not correct, after temperature and pressure increasing, the corrosion resistant layer of excessive solvent volatilization, make dry film is more thin, it is easy to break through the hole, when developing production must stay dry film toughness, therefore, the production of broken hole, Rocket PCB manufacturers recommend do improvement from the following aspects: SSD PCB/PCB 1.
Reduce the film temperature and pressure;
2.
Improve the hole wall roughness and phi front;
3.
Reduce stress development;
4.
To improve the energy of the exposure,
5.
Sticker, we use the dry film don't stretched zhang too tight;
6.
Then the park can't be too long, lest cause the corner area, semiliquid release. it spread thin.
Second, circuit board manufacturing dry film plating plating appears when plating, dry film and copper foil sticky is not strong, resulting in plating solution, and then cause the negative phase section plating thickening, circuit board manufacturers, mostly in plating, are caused by the following a few bad reasons: sticker is high or low temperature such as film temperature is too low, due to the corrosion film is not sufficient to soften and appropriate flow, lead to dry film with copper-clad laminate surface adhesion is poor;
If the temperature is too high due to resist the solvents and other volatile substances volatilizes quickly and produce bubbles, and the dry film brittle, formed in the electroplating electric case become warped, plating.
1.
Films at low pressure is high or low the paster, may cause the paster surface uneven or dry film with clearance and could not reach the requirements of bonding strength between copper plate;
Film pressure if too high, too much corrosion resistant layer of solvent and volatiles volatile, causing dry film brittle, plating after the shock will be case become warped.
2.
Sticker is high or low temperature such as film temperature is too low, due to the corrosion film is not sufficient to soften and appropriate flow, causing dry film with copper-clad laminate surface adhesion is poor;
If the temperature is too high due to resist the solvents and other volatile substances volatilizes quickly and produce bubbles, and the dry film brittle, formed in the electroplating electric case become warped, plating.
3.
Exposure energy is high or low under uv irradiation, absorbed the light energy of light initiator, decomposed into single light polymerization by free radical reaction, the size of the formation of insoluble in dilute alkali solution.
Underexposure when, due to inadequate aggregate, in the process of development, the film swelling soft, line is not clear or even film layer falls off, causing membrane combined with copper bad;
If overexposed, will cause the development difficulty, also can produce case become warped in the process of electroplating, plating.
So it's very important to control the exposure energy.
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