Resin plug hole process applied in
PCB circuit board industry in recent years more and more widely, especially in some layers high, high precision PCB thickness of multilayer PCB board larger products above is more popular.
People want to use resin plug hole to solve a series of using green oil plug hole or resin bonding, which can solve the problem.
Because this kind of circuit board technology, however, because of the characteristics of the resin used by itself, the need to overcome many difficulties on the circuit board production, can achieve good resin plug hole quality of the product.
So what do you know the process of the resin plug hole?
The next Rocket PCB circuit of small make up and everyone together to look at!
12 buried layer blind hole outer PCB PCB/PCB circuit boards without resin plug hole process (
1)
Outer production meet the requirements of negative, and the flux ratio Kong Hou 6:1 or less.
PCB circuit boards negative requirements need to meet the conditions as follows: line width/line gap is enough big, PTH hole is less than the largest dry film hole sealing ability, the biggest circuit board thickness is less than the requirements of the negative maximum thickness and so on.
And there are no special requirements of plate, special process of plate includes: local electric gold plate, gold plating nickel plate, half orifice plate, printing plug, acyclic PTH hole, PTH slots in the plate, etc.
The production of PCB inner - pressing - brown is changed back to the laser drilling, brown is changed to outer drilling, heavy copper - the whole plate hole filling plating - slice analysis - outer graphics - outer acid etching to outer AOI, subsequent normal process.
(
2)
Outer production meet the requirements of negative, tong Kong Hou to diameter ratio> 6:1.
Because Kong Hou diameter ratio> 6:1, use the whole board to fill hole plating not meet the requirements of general distributed copper thickness, the whole board to fill holes after plating, you need to use the common electroplating line in a plate thickness of electricity will be distributed copper plating to request, the specific process is as follows: the inner production - pressing - brown is changed back to the laser drilling, brown is changed to outer drilling, heavy copper - the whole plate hole filling plating - the full plate electroplating - slice analysis - outer graphics to outer acid etching, subsequent normal process (
3)
Outer did not meet the requirements of negative film, line width/line gap or a, and the outer flux ratio Kong Hou 6:1 or less.
The production of PCB inner - pressing - brown is changed to laser drilling, brown is changed to outer drilling, heavy copper back to the whole board and electroplating filling pore slice analysis, the outer graphics and graphics to outer alkaline etching, plating outer AOI and subsequent normal process.
(
4)
Outer did not meet the requirements of negative film, line width/line gap < a;
Or line width/line gap or a, Kong Hou to diameter ratio> 6:1.
The inner production - pressing - brown is changed back to the laser drilling, brown is changed to sink copper, the whole board fill hole plating - slice analysis - copper - outer hole - sink copper reduction (
2)
- the full plate electroplating - outer graphics - graphic to outer alkaline etching, plating outer AOI and subsequent normal process.
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