Tin on the circuit board is what leads to welding plate surface is uneven

by:Rocket PCB     2020-06-19
Cause analysis: 1. If the circuit board and balance, lifo, prone to PCB bending plate up defects; 2. Into liquid when welding plate tin stove by the liquid surface tension can cause welding arc shaped plate tin thickness is uneven, and because of the hot air blow force and the gravity of the solder tin hang soldersag nozzles, the SMT SMT parts of welding is not easy to stick, easy to cause welding parts after migration or tablet made phenomenon tombstoning; 3. The smaller circuit board solder tin solder surface arc shape, the more obvious, flatness, the worse. Tin PCB solution: less than 14 mil solder for BGA packaging board or plate with relatively high flatness requirement, consider tin exist hidden danger, do not recommend to make tin plate, can change to do heavy gold, gold-plated, if the customer must make spray tin circuit board, must clearly customer requirement for flatness. As a Rocket PCB PCB manufacturers, main business for the high-precision multi-layer circuit board, HDI board, thick copper, blind hole buried plate proofing and small batch, high frequency circuit board, and PCB board production. Business consulting: 18312562276 mr. li
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