Processing and manufacturing technology of multilayer circuit board

Industry-leading multi-layer circuit board processing and manufacturing technology procurement of top-level raw materials to create high-precision multi-layer PCB1 and top-level technical team for you, with rich production experience for precision multi-layer circuit boards ☆ all employees have 3- Professional and technical personnel with 12 years of PCB experience, exquisite technology ☆ 8 industrial scientific and technological innovations, 20 PCB production technology innovations, effective optimization of product structure 2, leading process capabilities, meet the requirements of precision multi-layer PCB board making ☆ maximum thickness-to-diameter ratio 10:1 maximum copper thickness 6OZ maximum working board size 2000x 610 ☆ thinnest 4-layer board 0. 33mm minimum mechanical hole/pad 0. 2/0. 40mm ☆ drilling accuracy /-0. 05mmPTH aperture tolerance /-0. 05mm ☆ minimum line width/line distance 0. 075/0. 075mm3.  Advanced automatic production equipment and precision inspection equipment ☆ equipped with a full set of surface treatment production lines for precision multilayer boards ☆ The company has introduced automatic V-cutting machines, German presses, Mitsubishi Laser drilling rigs, Hitachi mechanical drilling rigs, fully automatic exposure machine, LDI, aoi☆ a small number of industries are equipped with a full set of surface treatment equipment ( Gold precipitation, silver precipitation, tin precipitation, OSP, tin spraying, gold plating, thick gold plating, tin plating, silver plating) , Reduce the risk of outsourcing production for you 4.  Strict quality control system to ensure the qualified rate of shipment quality is 100% ☆ strictly control according to IPC standards, ensure the qualified rate of shipment quality is 100% ☆ import Germany's advanced temperature cycle inspection equipment to ensure high reliability and stability of products ☆ strictly implement the quality PDCA process to continuously improve product performance