High thermal conductivity ceramic substrate, essential for improving performance
High thermal conductivity ceramic substrate is a substrate made of ceramic material with high thermal conductivity, which is used for heat dissipation of electronic devices to improve performance and reliability. It is widely used in electronics, communications, electricity and other fields. It has good insulation, chemical stability and other characteristics. Aluminum nitride ceramic substrate is the most common and widely used one. It is a very excellent heat dissipation material with excellent thermal conductivity and plays an important role in the heat dissipation of electronic equipment. This article will deeply explore the thermal conductivity of aluminum nitride ceramic substrate and its application in electronic heat dissipation.
1. Thermal conductivity
The thermal conductivity of aluminum nitride ceramic substrate is between 170-230 W/mK, which is 2-3 times that of alumina ceramic and silicon-based ceramic, and 10-20 times that of titanium substrate. This excellent performance of high thermal conductivity is determined by the structure and chemical composition of aluminum nitride ceramic substrate. Its grain size, lattice constant, thermal expansion coefficient, specific heat capacity and density directly affect its thermal conductivity. Compared with other heat dissipation materials, aluminum nitride ceramic substrates have higher thermal conductivity efficiency, which can quickly dissipate the heat generated by electronic equipment and effectively protect the safe operation of the equipment.
2. Application scenarios
LED lighting
Aluminum nitride ceramic substrates are widely used in the field of LED lighting. LED lighting needs to generate a lot of heat, which needs to be dissipated by heat dissipation materials. Aluminum nitride ceramic substrates have excellent thermal conductivity and can quickly conduct and dissipate the heat generated by LEDs, thereby extending their life and improving their efficiency.
Electronic devices
Electronic devices also generate a lot of heat during operation, and heat dissipation materials are needed to reduce the temperature and ensure the safe operation of the equipment. Because aluminum nitride ceramic substrates have high thermal conductivity and excellent thermal stability, they can be closely connected with electronic devices to quickly conduct and dissipate heat, thereby ensuring the stability of the equipment.
Automobile engines
Automobile engines also generate a lot of heat during operation, and heat dissipation materials are needed to reduce the temperature. Aluminum nitride ceramic substrates have high high temperature resistance and excellent thermal conductivity, so their application in the field of automobile engines is becoming more and more extensive.
3. Research progress
The preparation technology of aluminum nitride ceramic substrates is constantly developing, such as high-temperature hot pressing, sol-gel method, liquid phase reaction method, etc., which can prepare aluminum nitride ceramic substrates with different morphologies and sizes.
Studies have shown that the use of aluminum nitride ceramic substrates as heat dissipation materials can greatly improve the heat dissipation efficiency of electronic devices, thereby ensuring their stability and life. For example, in the field of LED lighting, the use of aluminum nitride ceramic substrates as heat dissipation materials can improve the life and efficiency of LED lamps, while also reducing energy consumption.
Characteristics of high thermal conductivity ceramic substrates
1. High thermal conductivity: The thermal conductivity of high thermal conductivity ceramic substrates is usually above tens of watts per meter Kelvin, which is much higher than traditional ceramic materials and organic substrates. It can effectively transfer heat from heating elements to radiators and improve heat dissipation efficiency.
2. Good insulation performance: Ceramic substrates have good insulation performance and can withstand high voltage and high current, ensuring the safety and stability of circuits.
3. High mechanical strength: Ceramic substrates have high mechanical strength, can withstand large pressure and impact, and are not easy to break and deform.
4. Good chemical stability: Ceramic substrates have good chemical stability, can withstand corrosion from chemicals such as acids, alkalis, and salts, and are not easy to age or deteriorate.
5. Thin and lightweight: High thermal conductivity ceramic substrates can be prepared into thin and lightweight products to meet the needs of miniaturization and lightweight electronic equipment.
4. Conclusion
Aluminum nitride ceramic substrates have become a very suitable material for electronic heat dissipation due to their excellent thermal conductivity. It can quickly conduct and dissipate the heat generated by electronic equipment and effectively protect the safe operation of the equipment. It has a wide range of application prospects. The future development trend is to further improve its thermal conductivity, reduce costs, multifunctionality and greenness to meet the needs of different fields.
