Press-fit Coin Embedded PCB

Press-fit Coin embedded PCB

With the development of new generation information technology, energy saving and new energy vehicles, electric power equipment,aerospace and other fields, the solution of heat dissipation problem is imminent. At present, there are many ways to solve the problem of PCB heat dissipation, such as dense heat dissipation hole design, thick copper foil circuit, metal-based (core) structure, embedded copper coindesign, copper-based convex design, high thermal conductivity materials and so on. Embedding copper in PCB directly is one of the effective ways to solve the problem of heat dissipation.


Embedded copper printed circuit boards (PCBs) have the characteristics of high thermal conductivity, high heat dissipation and space saving,which can effectively solve the heat dissipation problem of high-power electronic components.

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