Lead Free Reflow
(260℃ peak) ×5 times
The quality of high-order HDI board and copper foil substrate becomes more and more strict with the trend of lightweight, short, high-function,high-density and high reliability of electronic system.
In the manufacture of copper foil substrate, the thickness and quality of copper foil substrate will be affected by the inspection specifications of rawmaterial glass fibre cloth, film baking conditions, glue content, glue flow rate, gelatinization time, conversion degree and storage conditions, etc. The control of thickness and quality needs to review the ownership process and improve the process capability to a certain extent. At present, copper foil base material manufacturers have gradually changed to non-contact laser thickness testing instead of manual centimeter sampling.
Rocket PCB is one of the few local PCB manufacturers that can provide high multilayer PCB board and any-layer interconnection HDI. It has complete quality, advanced technology and process. We focuse on high-level automotive electronics, consumer electronics, focusing on high-end PCB applications, platform advantages are obvious. Considering the process and staged via hole of mass production, the company has 64 layers of high-rise PCB board at present, and the order of HDI increase can reach 5 orders, with the minimum line width and line spacing of 40/45 micron. It can be seen that the company's high-level PCB board and HDI technology are in the leading level in China, and in terms of any layer of interconnected HDI that best reflects the technical capabilities of HDI, the company is also one of the few local manufacturers that can produce any layer of interconnected HDI. Driven by the two trends of electronic products: light, short and high-speed, high-frequency, the industrial structure of PCB has been constantly adjusted to high-end, and the proportion of high-end products represented by FPC, high multilayer pcb board and high-level HDI has been continuously increased.