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Press-fit Coin, copper coin PCB


Typical Index

Process Capability

Typical value

Layers

≤24L

6L

Size

≤18.5”×24.5”

18.2”×24.2”

Total Thickness

0.9mm-3.0mm

2.31mm

DHS

0.2mm  (min) 

0.25mm

A/R

14:1

9:1

Coin Size

short≥3mm, length≥7mm

24.8mm×6.2mm

Coin flatness

TOP side ±3mil

Bottom side +2/-6mil

TOP side ±3mil

Bottom +2/-6mil

Push force

≥50N

320N

Surface treatment

ENIG/IS/IT/GF

ENIG

structure

D/S, normal/hybrid, HDI

Hybrid Multilayer

Application

Communication, PA, RF

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