Press-fit Coin, copper coin PCB
Typical Index | Process Capability | Typical value |
Layers | ≤24L | 6L |
Size | ≤18.5”×24.5” | 18.2”×24.2” |
Total Thickness | 0.9mm-3.0mm | 2.31mm |
DHS | 0.2mm (min) | 0.25mm |
A/R | 14:1 | 9:1 |
Coin Size | short≥3mm, length≥7mm | 24.8mm×6.2mm |
Coin flatness | TOP side ±3mil Bottom side +2/-6mil | TOP side ±3mil Bottom +2/-6mil |
Push force | ≥50N | 320N |
Surface treatment | ENIG/IS/IT/GF | ENIG |
structure | D/S, normal/hybrid, HDI | Hybrid Multilayer |
Application | Communication, PA, RF | |
