Rigid Flex PCB is a new type of printed circuit board which has both the durability of rigid pcb and the adaptability of flexible PCB. Among all types of PCB, rigid flex board is the most resistant to harsh application environment, so it is favored by medical and military equipment manufacturers. China's enterprises are gradually increasing the proportion of rigid flex PCB in the total output.
The application scope of rigid flex PCB mainly includes: aerospace, such as high-end aircraft mounted weapon navigation system, advanced medical equipment, digital camera, portable camera and high-quality MP3 player. Rigid flex PCBs are most commonly used in military aircraft and medical equipment. Rigid flex composite board has brought great benefits to the design of military aircraft, because it can improve the reliability of the connection and reduce the weight. Of course, the benefits from smaller overall volume can not be ignored.
Although the cost of rigid flex composite board is higher than that of traditional rigid PCB board, it provides an ideal solution for the project. The use of flexible substrate interconnections, rather than multiple PCB connection equipment, is the key to reduce footprint and weight, which is required by many designs.
Rigid flex board has the characteristics of both rigid PCB and flexible PCB. It can bend, fold and shrink with the following characteristics:
1) Flexible and three-dimensional installation, effective use of installation space, reduce the volume of finished products
2) It has the strength of rigid plate and plays a supporting role
3) Rigid Flex PCB has small volume and light weight, which makes the product light and thin
4) Rigid Flex PCB has higher assembly reliability
5) It has excellent electrical properties, dielectric properties and heat resistance
6) It is difficult to make, high one-time cost, and can not be repaired after damage
Rigid flex PCB is a product composed of rigid circuit board (FR4) and flexible circuit board (FCCL) through adhesive.
Flexible board is thin and flexible. It is generally divided into glue base material and non glue base material.
Glued material: copper foil + adhesive layer + substrate
It has the advantages of low price, good dimensional stability, good adhesion between copper sheet and medium. Due to a variety of resin composition, heat resistance is general, easy to delamination
Glueless material: copper foil + base material
High price, single resin, good thermal stability, high reliability, but copper skin adhesion is slightly poor
It can be divided into rolled annealed copper foil (RA) and electrolytic copper foil (ED). The bending property of rolled copper foil is better than that of electrolytic copper foil, and the products with deep and high requirements for flexure are mainly used. Electrolytic copper foil is conducive to fine circuit production, and is used for products with low requirements on flexibility.
RA copper: Rolled Annealed Copper (9pum12um/17.5um35um70pum)
High flex life, good forming characteristics.
ED copper : Electrodeposited Copper(17.5um/35um/70um)
More cost effective.
Silver Ink: Most cost effective, poor electrical characteristics. Most often used as shielding or to make connections between copper layers.
ED: The rough crystal structure of electrolytic copper is not conducive to the yield of fine circuit
RA : The crystal structure of calendered copper is smooth, but its adhesion to the substrate is poor
Flexible board of dynamic continuous action
Flexible board with little continuous action for very fine lines
A flex board that is not dynamic but must bear motion
Flexible board with double electroplated through holes
Products with large radius and low deflection
Non dynamic soft board
>Bending assembly of 100m bending radius
Divided into polyimide (PI), polyester (PET), polytetrafluoroethylene (PTFE)
Polyimide (PI): Kapton TM (125um / 20um25um / 50 μ M / 75um)
It has excellent high temperature resistance, immersion welding resistance up to 260 ℃, 20sec, high dielectric strength, good electrical and mechanical strength, but easy to absorb moisture. It is a common base material for FPC
Polyester (PET): (25um / 50 μ M / 75um)
Many properties are similar to polyimide, but poor heat resistance, can only be used at room temperature.
Polytetrafluoroethylene (PTFE): only used in high frequency products with low dielectric constant
Coverlay: Cover layer from 2 mil to 5 mil (12. 7 to 127um)
The covering film is equivalent to the solder resist ink of rigid circuit board, which plays a role of solder resistance. The covering film is composed of adhesive +PI
FPC material- 2-layer FCCL Status
FPC material-3-layer FCCL Status
FPC material- coverlay layer Status
Comparison of coverlay features
Line design requirements in flexible area
To avoid sudden expansion or reduction of the line, use tear shape between thick and thin lines
It is recommended to use smooth angle to avoid acute angle
Structure is the most important factor in the design of rigid flex. It is necessary to make the process simple and reliable, and achieve the goal of low cost and applicability
a. The thickness should be as low as possible and the material types must be reduced
Too thick rigid flex not only has an adverse effect on the miniaturization of thick assembly products, but also causes inconvenience to the manufacturing process (especially the press fit). In addition, rigid flex materials include copper foil, polyimide film and acrylic glue. Because of the difference of thermal expansion coefficient, attention should be paid to the adhesion between layers after thermal shock
b. Stress prevention of bending point
In addition to reducing the stress of the contact edge between the flexible board and the rigid board or reinforcing it in the process of hot pressing, it is better to avoid the bending point
C. Considering the main shock resistance, the wiring arrangement should meet the requirements of folding resistance. If the product is applied in high vibration environment, it is also necessary to investigate in advance
d. In the aspect of manufacturing process, the possible problems in the process are foreseen, and the process is simplified to reduce the cost and improve the yield
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