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Backplane PCB board PCB backplane advanced backdrill PCB production

Backplane PCB board PCB backplane advanced backdrill PCB production

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
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Capabilities involved in PCB backplane design


CCL

Because the thickness of the backplane, size and is not the same as a conventional board, its performance requirements for the CCL is not the same

Thickness

The thickness of the backplane is thicker than that of the conventional board

Size

The size of the backplane is much larger, for production also has this certain impact

Drilling

Due to the increase in thickness and the use of crimp contact, the accuracy of drilling and the ability to copper plating has special requirements

The number of layers

The layer of the backplane also be developed to the high-level number, more than 10 layers of design is also more common.

Layout

Backplane wiring density is relatively small, but there are special requirements for impedance requirements and inner-layer lines.

Surface treatment

Due to the thickness of the backplane, size is relatively large, some surface treatment process is more difficult to achieve

Special process

Due to the characteristics of the backplane itself, the backplane sometimes uses some special processes.



OUR STRENGTHS
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In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger



CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing


FEATURES



  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias









Advanced Product and Technology
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Product Feature
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High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise




Our Services
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  • 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For Backplane board, will be based on board parameters, normally 15-30 days.

  • Effective and flexible PCB engineering solutions save your cost. We always put the best interests first when providing innovative solutions for manufacturing customers’ products, we are more willing to help customers grow.

  •   Rapid feedback on the layout,build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc.

  •   Strong partnerships with different reputed material suppliers such as Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide range of PCB applications.

  •   Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc.100% outgoing pass rate.

  •   Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.

  •   We will keep secret for customer sale area, design ideas, drawing and all other private information.

  •   Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.




Product Application
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Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               
Security Industry
Favorable rate
100%
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