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Aluminum Base Printed Circuit Board LED Light PCB Control Board

Aluminum Base Printed Circuit Board LED Light PCB Control Board

Name:
Aluminum PCB, Aluminum base pcb, LED pcb
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
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About our product


Rocket PCB uses the industry's excellent Bergquist materials, with high thermal conductivity insulation layer, to ensure the lowest operating temperature, brightest brightness and longest service life of LED. In fact, aluminium substrates with high thermal conductivity can be used in any LED application area.


However, most of the insulating layers of aluminium substrates on the market are made of commercialized FR-4 semi-cured sheets. These insulating layers are all made of epoxy resin. Although these insulating layers have good bonding properties, they have high thermal resistance (thermal conductivity is only the 0.3w/m·k) because they are not filled with high thermal conductivity and high insulation ceramic fillers.

If the aluminum substrate is used, the heat generated by the high power density module can hardly be transmitted to the metal substrate, so the thermal accumulation will accelerate the aging of the power module and eventually lead to the failure of the module. And the insulation strength of this kind of aluminium substrates is limited (<2ΣKVAC), it is difficult to meet the requirements of security testing, and can only be used in low power density situations. For high power density modules, it is difficult to be competent, and there are great hidden dangers.


Bergquist conducts 12 to 18 months of certification tests before each product is put on the market. Bergquist' comprehensive quality verification includes mechanical performance, bonding strength, electrical insulation performance and thermal conductivity performance tests. In order to verify the reliability of long-term use, a test cycle of 2000 hours is usually selected. The main results are as follows:


500 cycles lasting 350 hours in the range of 40℃~150℃

2000 hours thermal aging test at 175 ℃

1 minute at 300 ℃ and 72 hours thermal shock test at 200 ℃

 

It is these rigorous validation tests that ensure the supremacy of the bergquist thermal Clad in the industry.






There are also the following unique advantages,


  1. Compliance with RoHs requirements

  2. In the design of electric circuit, thermal diffusion can be treated effectively.

  3. Reducing the operating temperature of the module, prolonging the service life, increasing the power density and reliability

  4. Reduce the assembly of radiator and other hardware (including thermal interface materials), reduce module size, and reduce hardware and assembly costs;

  5. Replacing fragile ceramic substrates for better mechanical durability


PRODUCT COMPARISON
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VS



PRODUCT ADVANTAGES
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YIELD ADVANTAGES
  

> Our factories have invested heavily in importing advanced production facilities from abroad. Such as Burkle laminator, Mitsubishi laser drill, Hitachi mechanical drill, Japan screen automatic exposure machine, LDI, AOI etc, highly automated manufacturing. With a monthly output of up to 250,000 square meters.

> Our suppliers have formed a complete production process, become more professional, modern and large-scale, and signed long-term strategic cooperation agreements with well-known enterprises at home and abroad.

> Under the system of ISO 9001, ISO 14001, ISO/TS16949, OHSAS 18001, ISO/IEC27001, UL, SGS and RoHS, we have guaranteed our excellent quality and leading market position with strong technical development momentum. We also adhere to the 5S method, lean and Six Sigma quality system.


TECHNICAL ADVANTAGES
  

> We provide real-time and in-depth technical support and tailor-made application solutions, such as high speed, large capacity, high frequency, mixed pressure (hybrid structure), heat dissipation metal base solutions.

> Free DRC and DFM. Elite engineers with years of experience provide you with free and comprehensive engineering review and support.

> Rapid feedback on the layout, build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates and other engineering questions. When providing innovative solutions for our customers'products, we always consider maximizing the benefits for our customers.

Rocket provides industry-leading support to our customers,we are more willing to help customers grow.


Advanced Product and Advanced Technology 


SERVICE ADVANTAGES
  

> Quotation for standard projects within 2 hours, quick 24 hours PCB prototype making.

> Multiple different product lines meet the requests of fast delivery of small batches and multi-variety prototyping and mass production.

> Expedited production line for prototyping double-sided PCB up to 24 hours, 4 layers 48 hours, 6 layers 72 hours etc.

> Mass production of double-sided PCB 5-6 days lead time, multi-layer PCB 7-9 days for standard boards.

> DHL, FedEx, TNT, UPS Express, fully meet the customer's rapid turnover requirements, punctual delivery rate of more than 99%.




PRODUCT ADVANTAGES


> Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc. 100% outgoing pass rate.

> Provide 1-64 layers of different thickness, different materials, different processes of product customization, of which the CCL using A-class raw materials, high quality assurance.

> Unlimited PCB capabilities,we provide various and advanced technology PCBs include rigid, FPC, rigid-flex, metal core, microwave/RF, HDI, any layer, heavy copper, large-size, embedded, LED, backplane, ceramic substrate, IC substrate, high-frequency, high-density and high-performance PCB.

> Eight major surface treatment technology and high-quality ink printing, beautiful and reliable.





OUR STRENGTHS
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R&D is a key factor in developing new competitive advantage in the electronic manufacturing industry. Rocket PCB Solution Ltd in particular has devoted to R&D and as a result, we constantly soar ahead of competition. We have continued to absorb the talents from all directions to constitute the strong R&D team.

An innovative and creative R&D team is a key competitive advantage for Rocket PCB. Without this team, we could not have become a competitive manufacturer in the electronic manufacturing industry. The team focuses on midterm proactive development and long-term research, which includes quality improvement, operational efficiency, analysis of every stage of production, and new and existing PCB solutions. In order to maintain and improve R&D strength, our R&D team regularly participate in high-level seminar in the electronic manufacturing industry, keep close to the industry dynamics and frequently update their industry expertise. The long-standing commitment to R&D has brought our business results to the highest level.

To show our improving R&D capability in the market, we successfully developed Aluminum PCB. The distinctive characters are High quality and quick turn.
Rocket PCB is established as a provider of aluminum PCB with tailored service at affordable price. Aiming to become an international high-quality supplier in the electronic manufacturing industry, we will carry forward the outstanding spirit of 'Focus on customer first' and keep making progress in technology innovation, constantly challenge ourselves and provide better and better services for customers. Contact us today at
https://www.rocket-pcb.com to learn more about what we can offer to your business.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias



CAPABILITY LIST
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PRODUCT APPLICATIONS
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Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               

Security Industry



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