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Backplane PCB fabrication high multilayer PCB backplane

Backplane PCB fabrication high multilayer PCB backplane

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
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Product Advantage
  • Rocket PCB pays great attention to product quality and strives for perfection in every detail of products. This enables us to create fine products.
  • Rocket PCB Solution Ltd. is a modern company engaged in the production, processing, service and distribution of printed circuit board.
  • Rocket PCB has R&D talents with great technical capabilities and management talents with rich experience. Our company is able to develop sustainably thanks to them.

FEATURES OF BACKLANE


The backplane has a lot of distinctive features.
Size

A large part of the backplane is connected to some of the other boards at right angles. This requires that the backplane be much larger than conventional PCBs and that some backplanes even reach the 762mmx1066.8mm

The number of layers

In terms of the most common backplane, its layer is already in the 16~28, this number is much higher than the ordinary PCB

Thickness

From the structure of the backplane itself, in order to be able to withstand more mechanical stress, it has to be designed much thicker than ordinary PCB. In most cases, the designer has to increase its thickness, and the typical backplane thickness is 2mm-4mm, which can be as thick as 4mm-6mm.


With the continuous development of science and technology, users of bandwidth requirements are becoming more and more stringent, which requires that the design of the backplane to be precise and rigorous enough, the production process of ordinary PCB has been far from meeting the needs of modern production. In order to produce a backplane that meets a variety of conditions, it is necessary to eliminate some of the original conventional equipment and replace it with a hybrid bus structure and assembly technology.




Product CASE

High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise


Product application


               
Consumer electronics
               
Automotive electronics
               
Communications
               
Energy
               
Industrial & Instrumentation
               
IOT/Smart Home
               
Medical electronics
               
Security Industry
Favorable rate
100%
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