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China Rigid Flexible Rigid-flex Printed Circuit Boards PCB Manufacturer

China Rigid Flexible Rigid-flex Printed Circuit Boards PCB Manufacturer

Name:
Rigid-flex pcb,rigid and flex circuit boards
Material:
Polymide/PI, coverlay
Board thickness:
1.6mm
Surface treatment:
Immersion Gold, ENIG, Immersion silver/Sn, HASL, LF-HASL
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union,paypal
Certification:
ULConsumer(Wear,ElectronicDigital,HouseholdAppliances,Connectors)/IndustrialControl/AutomobileTS16949/Medical/Server,CloudComputing&BaseStation/Aviation/Military/Communication(CertificationinRelatedApplications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
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These PCBs integrate flexible PCBs and rigid PCBs. Because the connection between layers does not require connectors, they are ideal for digital devices that are susceptible to noise. In addition, these PCBs can be designed to create thinner devices with no-connector and three dimensions.
Rigid-flex printed circuit boards can help you reduce space and ensure that your products are able to withstand harsh conditions. Also, they are cost-effective.
A rigid-flex format allows you to use fewer interconnecting segments to take on more challenges. So the rigid-flex PCB is a very flexible solution to many design problems. They are suitable for industries ranging from hearing aids to night vision mirrors.



Common Structures of Rigid-flex PCB
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Our Strength
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Rocket PCB is an innovative manufacturer focusing on electronic manufacturing. Rocket PCB is dedicated to spending 10 years of efforts advancing itself. We develop, produce and sell numerous successful high-quality products, including rigid, rigid-flex, HDI, any layer, Flex, large-size, embedded, RF, LED, backplane, metal substrate, ceramic substrate, IC structure, high-frequency, heavy copper. High quality and high reliability.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing




FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias




Rigid-flex Quality Assurance
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Hole Reliability

Design
Manufacturing
Quality Control
> High TG Rigid material, High reliability Flexible material> Automatic Pasting Machine> Check the quality of hole copper plating
> Using no‐flow PP and common flow PP> High temperature lamination machine> 100% AOI to inspect the desmear result of Micro Via
> Partial Coverlay, PTH can’t drill in the adhesive

> High speed drilling machine

> 4 wire low resistance test

> PI Conditioner production line

> Horizontal Desmear and Horizontal PTH

> Copper via filling plating line and Pulse plating line


> Vacuum resin filling machine



Reliability Between Layers


Design

> High TG Rigid material, High reliability Flexible material

> Using no‐flow PP and common flow PP

> Dedicated design regulation of no‐flow PP filling copper

> Different squeezed‐out PP lengths use different manufacturing methods

> Partial Coverlay, Coverlay stretch into rigid part with 0.8‐2.0mm


Manufacturing

> Automatic Pasting Machine

> Plasma Machine

> High temperature lamination machine

> Different Rigid‐Flex structures use different buffering material




Quality Control

> Use micro section to check the blister and delamination after lamination

> Squeezed‐out PP of Rigid‐Flex interface less than 1.5mm

> Lead free reflow and thermal stress test, no delamination Plasma Machine







Registration Control

Design
Manufacturing
Quality Control
> Different structures have different working panel sizes> LDI exposure machine> Check the registration coupon of layers after lamination
> Different lamination position methods> Firstly make flex material pattern, after coverlay lamination to make rigid material pattern> Check breakout of pad after drilling
> Regulation of  copper designed in the spare of working panel

> ATP punch machine, INSPECTA target drill machine, divide the boards into different groups to manufacture

> Check soldermask on pad after soldermask process
> Registration coupon of layers
> BURKLE high temperature lamination machine

> Soldermask Split exposure machine


Product Application
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