Inspection is a key step in all PCB production processes. It can detect PCB defects in order to correct them and improve overall performance.

This article introduces in detail 7 common PCB surface treatment processes to help you compare and choose the appropriate surface treatment.

The successful manufacture of HDI PCB requires special equipment and processes, such as laser drilling, hole filling and electroplating, laser direct imaging and sequential lamination cycle.

The history of Rocket PCB has been shaped by high density interconnect (HDI) printed circuit boards. In 2002 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications throughout the electronics industry, and their use was given additional impetus by the introduction of BGA/CSP components. Rocket PCB offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.

The most detailed illustration about PCB manufacturing process.

PCB drilling is a very important process in PCB manufacturing process, it has three common drilling methods.

HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.

PCB manufacturing has many applications, but we will introduce the 10 most common uses of printed circuit boards.

In general, the cost of raw materials accounts for 60% of the cost of PCB, and its price fluctuation cost has a great impact on the overall development of the PCB industry. PCB raw materials are a plate that can not be ignored by enterprises in the industry.

FPC, in fact, belongs to a kind of PCB, but it is quite different from the traditional printed circuit board.

With more density came more power dissipation and thus more heat generation. So a usual FR-4 based substrate PCB was not capable to withstand such high temperatures and thermal characteristics of FR-4 was not up to mark, hence the researchers found the solution in the form of "Ceramic PCB".

Lead-free PCBs (Printed Circuit Boards) were first called for just for the compliance of ROHS (Restriction Of Hazardous Substances) that requires all the electronics have to conform to ROHS regulations. As a result, PCB fabrication starts to convert from lead to lead-free.