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Rocket PCB top brand wire bonding process wire for automotive

Rocket PCB top brand wire bonding process wire for automotive

Rocket PCB top brand wire bonding process wire for automotive

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB top brand wire bonding process wire for automotive
Application Scope
Rocket PCB's HDI PCB can be used in different fields.Rocket PCB has been engaged in the production of printed circuit board for many years and has accumulated rich industry experience. We have the ability to provide comprehensive and quality solutions according to actual situations and needs of different customers.
Product Comparison
Good materials, advanced production technology, and fine manufacturing techniques are used in the production of PCB prototyping. It is of fine workmanship and good quality and is well sold in the domestic market.Compared with other products in the industry, PCB prototyping has more obvious advantages which are reflected in the following aspects.
  • v s
Company Advantages
1. wire bonding process 's structure has been developed using aluminum wire bonding process idea.
2. wire bonding process is widely polulor around the world.
3. The efforts of our team finally worked out to produce wire bonding process with aluminum wire bonding process .
4. Every product is a perfect embodiment of quality in Rocket PCB Solution Ltd..
5. Rocket PCB Solution Ltd. is well-funded, has advanced equipment and a group of highly skilled professionals.

methods


Rocket PCB top brand wire bonding process wire for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB top brand wire bonding process wire for automotive-2                
Consumer electronics
Rocket PCB top brand wire bonding process wire for automotive-3                
Automotive electronics
Rocket PCB top brand wire bonding process wire for automotive-4                
Communications
Rocket PCB top brand wire bonding process wire for automotive-5                
Energy
Rocket PCB top brand wire bonding process wire for automotive-6                
Industrial & Instrumentation
Rocket PCB top brand wire bonding process wire for automotive-7                
IOT/Smart Home
Rocket PCB top brand wire bonding process wire for automotive-8                
Medical electronics
Rocket PCB top brand wire bonding process wire for automotive-9                
Security Industry

Company Features
1. The main business of Rocket PCB covers the manufacturing and sales service of wire bonding process .
2. We have been working with customers from different countries for many years, such as Europe and the United States. Now, we are expanding the marketing channels to cover more countries including Japan, Germany, and Korean.
3. Our service team in Rocket PCB Solution Ltd. is well-trained so as to provide satisfying service for customers. Contact us! aluminum wire bonding process is the management tenet from the first beginning. Contact us!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!