The #1 Reason PCBs Fail Is NOT Your Schematic
Design Rule Check only verifies software rules, not factory reality.
Common issues we see every week:
Annular rings too small for plating tolerance
Via structures incompatible with HDI process limits
Stackups that look right electrically but fail lamination
Result: Low yield, delays, redesign costs.
Many stackups are designed theoretically — not manufacturably.
Typical mistakes:
Asymmetric layer builds causing warpage
Over-specifying materials without performance gain
Ignoring impedance tolerance variation
Result: High cost, unstable impedance, inconsistent quality.
Problem 2: Stackups Designed Without the Factory
DFM should guide layout decisions — not approve them afterward.
When DFM is applied early:
Routing density improves
Fabrication yield increases
Overall cost drops significantly
Manufacturing truth: Early DFM saves more than any last-minute fix.
Top-performing engineering teams do three things differently:
Design with the fabricator in mind
They understand process limits before routing begins.
Optimize stackup for both performance & yield
Not every board needs premium materials.
Validate manufacturability early
Real engineers talk to real PCB factories.
The best PCB designs are not just electrically correct — They are manufacturable, repeatable, and scalable.
That’s the difference between a prototype that works and a product that ships.
