AI Becomes the Core Growth Engine

With large-scale deployment of AI models and continuous expansion of data centers, server platforms are rapidly upgrading toward higher bandwidth, lower latency, and greater computing density.

As a result, PCB specifications are evolving in several key directions:

• Higher layer counts and more complex stack‑ups

• Tighter impedance control and signal integrity requirements

• Increased adoption of low‑loss, high‑frequency materials

• Wider use of back drilling, HDI, and advanced via structures

High‑speed and high‑frequency PCBs are becoming standard configurations for AI servers and network switches, significantly increasing the technical threshold and added value of PCB products.

Capital Market Reflects Industry Confidence

Since the beginning of 2026, PCB‑related companies in major global markets have shown strong performance, supported by optimistic shipment forecasts and expanding capacity utilization rates.

Market analysts generally believe that the AI infrastructure build‑out cycle is still in its early stage, and the demand for high‑end PCBs will remain strong for the next several years. This long‑term visibility is encouraging manufacturers to increase investments in advanced equipment, process automation, and high‑frequency material processing capabilities.

High‑End PCB Technologies in Focus

Under the combined impact of AI computing, 5G/6G communication, automotive electronics, and industrial automation, the PCB industry is undergoing a clear shift toward high value‑added products, including:

• High‑speed and high‑frequency multilayer PCBs

• HDI and ultra‑fine line PCBs

• Rigid‑flex and advanced flexible circuits

• Heavy copper and high‑power boards

• Metal core and embedded copper structures

These products are increasingly used in mission‑critical systems where electrical performance stability and long‑term reliability are essential.

Industry Outlook

Looking ahead to 2026 and beyond, industry experts expect the global PCB market to continue expanding steadily, with AI‑related applications remaining the primary growth driver.

At the same time, environmental compliance, intelligent manufacturing, and digital supply chain management will become important factors shaping the competitiveness of PCB manufacturers.

Companies with strong technical capabilities, stable quality systems, fast delivery performance, and comprehensive service models are expected to gain greater market share as customers seek long‑term, reliable partners in an increasingly complex electronics ecosystem.

Rocket-PCB Industry Perspective

Rocket-PCB believes that the next stage of PCB competition will not be defined by capacity alone, but by the ability to consistently deliver high-speed signal integrity, material stability, manufacturing precision, and fast response at scale.

Based on current project trends from global customers, the company observes several clear changes in procurement behavior:

• Customers are placing greater emphasis on controlled impedance accuracy and low-loss material traceability.

• Design cycles are becoming shorter, increasing demand for 3–5 day quick-turn prototypes with production-level quality.

• More projects require complex stack-ups, back drilling, HDI structures, and mixed-material constructions.

• Long-term cooperation and engineering support are becoming key decision factors, not just unit price.

Rocket-PCB expects that manufacturers with strong engineering teams, stable raw material supply chains, and mature process control systems will be best positioned to benefit from the AI-driven upgrade cycle.

The company will continue to invest in high-frequency material processing capabilities, advanced inspection systems, and digitalized customer service workflows to support customers building next-generation AI and high-speed computing platforms.

This article is for industry information sharing only and does not constitute any investment advice.