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Rocket PCB top brand printed circuit board industry bulk fabrication for digital device

Rocket PCB top brand printed circuit board industry bulk fabrication for digital device

Rocket PCB top brand printed circuit board industry bulk fabrication for digital device

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Application Scope
Rocket PCB's PCB prototyping is widely used in the Manufacturing Electrical Equipment & Supplies PCB & PCBA industry.Rocket PCB always gives priority to customers and services. With a great focus on customers, we strive to meet their needs and provide optimal solutions.
Product Comparison
PCB prototyping has the following advantages: well-chosen materials, reasonable design, stable performance, excellent quality, and affordable price. Such a product is up to the market demand.Compared with other products in the same category, PCB prototyping produced by Rocket PCB has the following advantages.
  • v s
Company Advantages
1. Ideas for the design of Rocket PCB wire bonding services are presented under high technologies. The product's shapes, colors, dimension, and matching with space will be presented by 3D visuals and 2D layout drawings.
2. printed circuit board industry has several advantages such as wire bonding services .
3. printed circuit board industry has the functions such as wire bonding services , which is used in semiconductor wire bonding .
4. Being a versatile design element that can serve decorative and functional purposes, this product is one of the most popular elements in modern mid- and high-rise design.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-1


methods


Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-3



Product application


Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-4                
Consumer electronics
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-5                
Automotive electronics
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-6                
Communications
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-7                
Energy
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-8                
Industrial & Instrumentation
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-9                
IOT/Smart Home
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-10                
Medical electronics
Rocket PCB top brand printed circuit board industry bulk fabrication for digital device-11                
Security Industry

Company Features
1. For many years, Rocket PCB Solution Ltd. has made the purchase of wire bonding services convenient and fast for customers. We provide fast turnaround in design and manufacturing.
2. The factory has attached great importance to and continuously improve the quality management and production control systems. These two systems have helped us offer the best quality products for the customers.
3. To be a well known and influential printed circuit board industry supplier is the goal of Rocket PCB. Check now! Rocket PCB is committed to working with customers to achieve a win-win situation. Check now! If you come, Rocket PCB Solution Ltd. will make our utmost to serve you well. Check now! Rocket PCB Solution Ltd. is committed to creating excellent company that has provides solutions for wire bonding . Check now!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!