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Rocket PCB stacked pcb manufacturing process pcb

Rocket PCB stacked pcb manufacturing process pcb

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB stacked pcb manufacturing process pcb
Product Details
With the pursuit of excellence, Rocket PCB is committed to showing you unique craftsmanship in details.Rocket PCB's pcb fabrication is manufactured in strict accordance with relevant national standards. Every detail matters in the production. Strict cost control promotes the production of high-quality and priced-low product. Such a product is up to customers' needs for a highly cost-effective product.
Company Advantages
1. The inspections of Rocket PCB pcb prototyping are conducted at each step. For examples, it has been checked on shrinkage, size, and shapes, flawlessness, symmetry, and cleanliness.
2. pcb manufacturing process get great attention for such features of pcb prototyping .
3. Consumers praise it for its good color retention. Even if the consumer washes with a chemical cleaning solution or other heavy-duty cleaning solution, it still maintains a perfect color.
4. When using this product, people can free their hands to some extent. This product provides them safer and more comfortable working conditions.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





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EXTENSIVE ANALYTICAL TESTINGRocket PCB stacked pcb manufacturing process pcb-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. As a high-tech company, Rocket PCB Solution Ltd. has been mainly engaged in the research and development and production of pcb manufacturing process.
2. We have built a unique highly-skilled R&D team composed of professors and experienced technicists. They play a key role in the research and development of our products and meet the challenge needs of our customers.
3. We believe it is our responsibility to behave in a manner that is both responsible and ethical. We have due regard for our shareholders, employees or the communities that are impacted by us or benefit from our activities. We take "Customer First and Continual Improvement" as the company's tenet. We have established a customer-centric team who specially solve problems, such as responding to customers' feedback, giving advice, knowing their concerns, and communicating with other teams to make the problems be solved. As a company bearing social responsibility, we continually improve and monitor environmental performance, and increase environmental awareness and training with all staff members. Our business goal is to innovate new ways to rapidly respond to our customers' needs, by collaborating with our employees, suppliers, and customers.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!