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Rocket PCB multi-layer pcb manufacturing process mircovias at discount

Rocket PCB multi-layer pcb manufacturing process mircovias at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB multi-layer pcb manufacturing process mircovias at discount
Application Scope
Rocket PCB's PCB prototyping can be widely used in various fields.Rocket PCB is committed to producing quality printed circuit board and providing comprehensive and reasonable solutions for customers.
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Product Comparison
Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture HDI PCB. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.HDI PCB's outstanding advantages are as follows.
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Company Advantages
1. Rocket PCB dual layer pcb is of high quality and standard. Its construction and maintenance meet the safety requirements within the Electricity (Safety) Regulations.
2. Featured with high performance, pcb manufacturing process has a high practical value.
3. The safety performance of the product far exceeds the average level in the market.
4. People can rest assured that it will not generate any radiation hazard and static which do harm to their health.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB multi-layer pcb manufacturing process mircovias at discount-1





Rocket PCB multi-layer pcb manufacturing process mircovias at discount-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB multi-layer pcb manufacturing process mircovias at discount-3



Anylayer PCB DFM suggestion for layout


Rocket PCB multi-layer pcb manufacturing process mircovias at discount-4

Rocket PCB multi-layer pcb manufacturing process mircovias at discount-5



Product FEATURES


Rocket PCB multi-layer pcb manufacturing process mircovias at discount-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

Rocket PCB multi-layer pcb manufacturing process mircovias at discount-7


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

Rocket PCB multi-layer pcb manufacturing process mircovias at discount-8


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





Rocket PCB multi-layer pcb manufacturing process mircovias at discount-9

EXTENSIVE ANALYTICAL TESTINGRocket PCB multi-layer pcb manufacturing process mircovias at discount-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



Rocket PCB multi-layer pcb manufacturing process mircovias at discount-11


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


Rocket PCB multi-layer pcb manufacturing process mircovias at discount-12                
Consumer electronics
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-13                
Automotive electronics
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-14                
Communications
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-15                
Energy
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-16                
Industrial & Instrumentation
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-17                
IOT/Smart Home
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-18                
Medical electronics
Rocket PCB multi-layer pcb manufacturing process mircovias at discount-19                
Security Industry

Company Features
1. Rocket PCB has been specialized in producing pcb manufacturing process for years.
2. Over the years, we have been fortunate to attract some of the most talented professionals in our industry. They are dedicated to proving the very best service and response levels in the industry.
3. Professional after-sales service and the Rocket PCB branded double layer pcb will satisfy you. Check now! With the support of our professionals, Rocket PCB has enough confidence to make any-layer pcb . Check now! Rocket PCB Solution Ltd. always improving our designs and models to acquire the world market. Check now!
Product Message
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