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integrated pwb board packaging for equipment

integrated pwb board packaging for equipment

Integrated pwb board packaging for equipment

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of integrated pwb board packaging for equipment
Company Advantages
1. The fiber as well as the fabric of Rocket PCB pwb board is minimally processed and finished without harmful chemical softeners, chlorine bleach, and heavy metal dyes. It takes less time in assembling a circuit as compared to the conventional method
2. In a short span of few years, with sophisticated equipment, extensive experience and sincere service, Rocket PCB Solution Ltd. developed rapidly. It is properly laid out, giving less electronics noise
3. The quality of this product is strictly controlled by our professional quality check team.
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

integrated pwb board packaging for equipment-1

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


integrated pwb board packaging for equipment-2                
Consumer electronics
integrated pwb board packaging for equipment-3                
Automotive electronics
integrated pwb board packaging for equipment-4                
Communications
integrated pwb board packaging for equipment-5                
Energy
integrated pwb board packaging for equipment-6                
Industrial & Instrumentation
integrated pwb board packaging for equipment-7                
IOT/Smart Home
integrated pwb board packaging for equipment-8                
Medical electronics
integrated pwb board packaging for equipment-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has been concentrated on the production of pwb board . Over the years, we've been fortunate to earn reputation from customers around the world. We have excellent manufacturing and innovation capabilities guaranteed by international advanced prototype circuit board equipment.
2. Our ic substrate pcb production equipment possesses many innovative features created and designed by us.
3. All our technician in Rocket PCB Solution Ltd. are well trained to help customers solve problems for metal core pcb . Our goal is to be the leading manufacturer. Ask!
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Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!