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Rocket PCB wholesale wire bonding technology surface finished for automotive

Rocket PCB wholesale wire bonding technology surface finished for automotive

Rocket PCB wholesale wire bonding technology surface finished for automotive

Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Enterprise Strength
  • Rocket PCB provides practical services based on different customer demand.
Product Comparison
PCB prototyping is in line with the stringent quality standards. The price is more favorable than other products in the industry and the cost performance is relatively high.PCB prototyping's outstanding advantages are as follows.
Company Advantages
1. All the fabrics used in Rocket PCB semiconductor wire bonding are lacking any sort of toxic chemicals such as banned Azo colorants, formaldehyde, pentachlorophenol, cadmium, and nickel. And they are OEKO-TEX certified.
2. This product provided by Rocket PCB is at the best possible rate with the best quality.
3. The quality check team adopts impeccable quality of testing instruments and system to make sure the best quality.
4. Rocket PCB Solution Ltd. can ensure the fastest and most accurate delivery date for wire bonding technology .
5. Developing Rocket PCB needs the support of professional customer service.

methods

Rocket PCB wholesale wire bonding technology surface finished for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB wholesale wire bonding technology surface finished for automotive-2                
Consumer electronics
Rocket PCB wholesale wire bonding technology surface finished for automotive-3                
Automotive electronics
Rocket PCB wholesale wire bonding technology surface finished for automotive-4                
Communications
Rocket PCB wholesale wire bonding technology surface finished for automotive-5                
Energy
Rocket PCB wholesale wire bonding technology surface finished for automotive-6                
Industrial & Instrumentation
Rocket PCB wholesale wire bonding technology surface finished for automotive-7                
IOT/Smart Home
Rocket PCB wholesale wire bonding technology surface finished for automotive-8                
Medical electronics
Rocket PCB wholesale wire bonding technology surface finished for automotive-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd., founded as a manufacturing company, manufactures and markets a number of different wire bonding technology for many years.
2. We have been supplying products to clients in North Amerca, Europe, South Africa, and Asia for many years. And most of those clients have become our stable partners and friends in business cooperations.
3. We aim to be leader in the wire bonding process industry. Check now! Rocket PCB Solution Ltd. will become a highly competitive enterprise in printed circuit board industry market. Check now!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!