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Rocket PCB wholesale wire bonding process bulk fabrication for automotive

Rocket PCB wholesale wire bonding process bulk fabrication for automotive

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB wholesale wire bonding process bulk fabrication for automotive
Product Comparison
Rocket PCB has great production capability and excellent technology. We also have comprehensive production and quality inspection equipment. PCB prototyping has fine workmanship, high quality, reasonable price, good appearance, and great practicality.Compared with same kind of products in the industry, PCB prototyping has the following highlights due to the better technical capability.
  • Rocket PCB wholesale wire bonding process bulk fabrication for automotive-Rocket PCB-img
    Rocket PCB wholesale wire bonding process bulk fabrication for automotive-Rocket PCB-img
Enterprise Strength
  • Rocket PCB continuously maintains relationships with regular customers and keeps ourselves to new partnerships. In this way, we construct a nationwide marketing network to spread the positive brand culture. Now we enjoy a good reputation in the industry.
Company Advantages
1. The design of Rocket PCB wire bonding process involves many factors. They are the inspiration, drawing, color, design functionality, technical package, garment patterns and so on.
2. This product features desired air permeability which can induce the proper dry and evaporative heat loss for keeping comfortable in sleep.
3. The product is so popular in the industry that many customers make full use of it.
4. The product is widely accepted by our customers and it will become a hot product in the industry.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB wholesale wire bonding process bulk fabrication for automotive-1


methods


Rocket PCB wholesale wire bonding process bulk fabrication for automotive-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Rocket PCB wholesale wire bonding process bulk fabrication for automotive-3



Product application


Rocket PCB wholesale wire bonding process bulk fabrication for automotive-4                
Consumer electronics
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-5                
Automotive electronics
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-6                
Communications
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-7                
Energy
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-8                
Industrial & Instrumentation
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-9                
IOT/Smart Home
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-10                
Medical electronics
Rocket PCB wholesale wire bonding process bulk fabrication for automotive-11                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. has extensive experience in manufacturing simple pcb board. We are famous in the industry for our strong capabilities.
2. Rocket PCB has been dominating the wire bonding process market owing to the core technology to produce the finest products.
3. We have adhered to the principle of continuously creating values to clients for many years, We will continue to provide quality services and achieve the best product values for clients. We support green production to gear to sustainable development. We have adopted approaches for waste disposal and discharge that will not pose a negative impact on the environment. With a commitment to continuous sustainability, we work hard to utilize the natural resources we consume including raw materials, energy, and water as efficiently as possible.
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