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Rocket PCB top brand wire bonding technology surface finished for automotive

Rocket PCB top brand wire bonding technology surface finished for automotive

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB top brand wire bonding technology surface finished for automotive
Enterprise Strength
  • Rocket PCB runs a comprehensive service system covering from pre-sales to sales and after-sales. Customers can rest assured during the purchase.
Product Details
Rocket PCB pursues perfection in every detail of PCB maker, so as to show quality excellence.Closely following the market trend, Rocket PCB uses advanced production equipment and manufacturing technology to produce PCB maker. The product receives favors from the majority of customers for the high quality and favorable price.
Company Advantages
1. Rocket PCB wire bonding technology is designed by ourselves with the inspiration we find at various trade shows.
2. Our professional technical team greatly optimizes the performance of our products.
3. People can trust that it can directly contact with bare skin without causing any skin allergies or other skin-sensitive symptoms.

methods


Rocket PCB top brand wire bonding technology surface finished for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB top brand wire bonding technology surface finished for automotive-2                
Consumer electronics
Rocket PCB top brand wire bonding technology surface finished for automotive-3                
Automotive electronics
Rocket PCB top brand wire bonding technology surface finished for automotive-4                
Communications
Rocket PCB top brand wire bonding technology surface finished for automotive-5                
Energy
Rocket PCB top brand wire bonding technology surface finished for automotive-6                
Industrial & Instrumentation
Rocket PCB top brand wire bonding technology surface finished for automotive-7                
IOT/Smart Home
Rocket PCB top brand wire bonding technology surface finished for automotive-8                
Medical electronics
Rocket PCB top brand wire bonding technology surface finished for automotive-9                
Security Industry

Company Features
1. Rocket PCB has high technology and expertise to produce wire bonding technology .
2. From material selection to package for wire bonding pcb , Rocket PCB Solution Ltd. always aims high in quality.
3. Rocket PCB is committed to providing customers with one-stop shopping convenience. Get quote! We boast competitive teams. They allow for the application of multiple skills, judgments, and experiences that are most appropriate for projects requiring diverse expertise and problem-solving skills. Our company's mission is to ensure that our customers are absolutely satisfied. We work hard to provide reliable value: from initial quotation to final delivery, we provide good value and operate in an honest, upright and straightforward manner. Get quote!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!