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Rocket PCB thermal metal base pcb material conductivity for base material

Rocket PCB thermal metal base pcb material conductivity for base material

Name:
Ceramic Substrate
Material:
Ceramic
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB thermal metal base pcb material conductivity for base material
Product Details
With a focus on details, Rocket PCB strives to create high-quality PCB prototyping.Rocket PCB provides diversified choices for customers. PCB prototyping is available in a wide range of types and styles, in good quality and in reasonable price.
  • Rocket PCB thermal metal base pcb material conductivity for base material-Rocket PCB-img
Company Advantages
1. Rocket PCB metal base pcb will be tested in terms of various aspects. It will go through both physical and mechanical tests, including symmetry check, color shading, colorfastness, odor testing, size fitting, and burn tests.
2. The product has an elegant translucent appearance. It has gone through vitrification and sintering at a temperature of up to 2000 degree Fahrenheit, which gives it a unique brightness, whiteness, and translucency.
3. The product is not prone to shrinkage. The fabric is tightly woven with a firm structure that is not prone to the damage from the outside environment.
4. Without good quality, metal base pcb can't be keeping stable rise for sales volume in its market.


Rocket PCB is good at aluminium oxide ceramic-based CCL PCB, alumina ceramic PCB, LED ceramic PCB, Al2O3 ceramic PCB, high thermal conduction ceramic PCB, ceramic-based PCB fabrication.

The ceramic PCB relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. It's an indispensable basic material for power module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conductivity, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.


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Product FEATURES


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Ceramics are superior to other printed circuit boards

  ◪   Higher operating temperatures up to 350℃

  ◪   Low expansion coefficient

  ◪   Good thermal performance

  ◪   Superior high-frequency performance

  ◪   Reduce costs for testing, insertion and assembly

  ◪   Smaller package size

  ◪   Sealed packaging with a water absorption rate of 0%



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is born from the know-how rooted in the territory, and from the company’s strong international character. We are experienced in developing and producing ceramic substrate pcb .
2. metal base pcb is assembled by our highly skilled professionals.
3. In an effort to ensure compliance with ethical and legal standards we start with encouraging a culture of integrity. We establish, embed and enforce integrity standards across our company through our Code of Conduct. We are searching for new ways to address our production impacts. We achieve this goal by reducing our operational gas emissions and production waste and constantly improving production efficiency.
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