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Rocket PCB stagger any-layer pcb layer for wholesale

Rocket PCB stagger any-layer pcb layer for wholesale

Rocket PCB stagger any-layer pcb layer for wholesale

10 layer ELIC printed circuit board, any layer PCB fabrication
Board thickness:
Surface treatment:
Immersion Gold
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
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Quantity Needed:
Enterprise Strength
  • Rocket PCB has a professional service team to provide quality and efficient services for customers.
Application Scope
PCB maker developed and produced by Rocket PCB is widely applied to many industries and fields. It can fully meet the diversified needs of customers.Rocket PCB could customize comprehensive and efficient solutions according to customers' different needs.
Company Advantages
1. During the production of Rocket PCB any-layer pcb , its quality is paid 100% attention. It is controlled by our quality team adopting the highest GB and IEC standard.
2. The product uses no electricity. It is 100% off grid and effectively reduces the electricity demand by up to 100% during the day and night.
3. The product features reliable operation. It has an advanced electrical system that is equipped with overvoltage, overcurrent, and overheating protection.
4. People will find the advantages of this product: excellent quality, well-fitting, and the color is as bright as the picture.

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

Rocket PCB stagger any-layer pcb layer for wholesale-1

Rocket PCB stagger any-layer pcb layer for wholesale-2

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%


ROCKET PCB Any Layer PCB (ELIC)process flow

Rocket PCB stagger any-layer pcb layer for wholesale-3

Anylayer PCB DFM suggestion for layout

Rocket PCB stagger any-layer pcb layer for wholesale-4

Rocket PCB stagger any-layer pcb layer for wholesale-5


Rocket PCB stagger any-layer pcb layer for wholesale-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.


With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Product application

Rocket PCB stagger any-layer pcb layer for wholesale-7                
Consumer electronics
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Automotive electronics
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Rocket PCB stagger any-layer pcb layer for wholesale-10                
Rocket PCB stagger any-layer pcb layer for wholesale-11                
Industrial & Instrumentation
Rocket PCB stagger any-layer pcb layer for wholesale-12                
IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a highly qualified manufacturer of dual layer pcb with years of experience. We are recognized as one of the most powerful producers.
2. The Rocket PCB's commitment to quality improvement of any-layer pcb is unwavering.
3. As a responsible organization, our company is actively involved in CSR & preserving environment projects for the well-being of the community. We will always mobilize employees in our different departments to work together to find solutions to help create a greater positive impact. Inquire!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!