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Rocket PCB stacked pcb manufacturing process fabrication at discount

Rocket PCB stacked pcb manufacturing process fabrication at discount

Rocket PCB stacked pcb manufacturing process fabrication at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Company Advantages
1. The production of Rocket PCB HDI PCB fabrication abides by the international quality standards. Its signal paths are well organized and exposed quite well
2. This is a favorable point for this product as it does not have any internal process so the noise decreases to zero. It plays an important role in modern electronic equipment
3. It is recognized for strong durability and relatively long service life. It takes less time in assembling a circuit as compared to the conventional method
4. The product has an extremely long service life through high-intensity detection. Its simple design makes it easier for users to maintain and manipulate
5. The added value of quality and reliability of the product is attributed to the implementation of scientific quality management. The electronic components and their polarities on it are clearly labeled


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB stacked pcb manufacturing process fabrication at discount-1





Rocket PCB stacked pcb manufacturing process fabrication at discount-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB stacked pcb manufacturing process fabrication at discount-3



Anylayer PCB DFM suggestion for layout


Rocket PCB stacked pcb manufacturing process fabrication at discount-4

Rocket PCB stacked pcb manufacturing process fabrication at discount-5



Product FEATURES


Rocket PCB stacked pcb manufacturing process fabrication at discount-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

Rocket PCB stacked pcb manufacturing process fabrication at discount-7


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

Rocket PCB stacked pcb manufacturing process fabrication at discount-8


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





Rocket PCB stacked pcb manufacturing process fabrication at discount-9

EXTENSIVE ANALYTICAL TESTINGRocket PCB stacked pcb manufacturing process fabrication at discount-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



Rocket PCB stacked pcb manufacturing process fabrication at discount-11


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


Rocket PCB stacked pcb manufacturing process fabrication at discount-12                
Consumer electronics
Rocket PCB stacked pcb manufacturing process fabrication at discount-13                
Automotive electronics
Rocket PCB stacked pcb manufacturing process fabrication at discount-14                
Communications
Rocket PCB stacked pcb manufacturing process fabrication at discount-15                
Energy
Rocket PCB stacked pcb manufacturing process fabrication at discount-16                
Industrial & Instrumentation
Rocket PCB stacked pcb manufacturing process fabrication at discount-17                
IOT/Smart Home
Rocket PCB stacked pcb manufacturing process fabrication at discount-18                
Medical electronics
Rocket PCB stacked pcb manufacturing process fabrication at discount-19                
Security Industry

Company Features
1. We adopt world-advanced technology when manufacturing pcb manufacturing process.
2. We work to implement important strategic sustainable initiatives to reduce our environmental footprint. We search for new opportunities to improve resource efficiency and reduce production waste.
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!