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Rocket PCB stacked any-layer pcb mircovias at discount

Rocket PCB stacked any-layer pcb mircovias at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB stacked any-layer pcb mircovias at discount


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB stacked any-layer pcb mircovias at discount-1





Rocket PCB stacked any-layer pcb mircovias at discount-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB stacked any-layer pcb mircovias at discount-3



Anylayer PCB DFM suggestion for layout


Rocket PCB stacked any-layer pcb mircovias at discount-4

Rocket PCB stacked any-layer pcb mircovias at discount-5



Product FEATURES


Rocket PCB stacked any-layer pcb mircovias at discount-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

Rocket PCB stacked any-layer pcb mircovias at discount-7


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

Rocket PCB stacked any-layer pcb mircovias at discount-8


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





Rocket PCB stacked any-layer pcb mircovias at discount-9

EXTENSIVE ANALYTICAL TESTINGRocket PCB stacked any-layer pcb mircovias at discount-10


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



Rocket PCB stacked any-layer pcb mircovias at discount-11


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


Rocket PCB stacked any-layer pcb mircovias at discount-12                
Consumer electronics
Rocket PCB stacked any-layer pcb mircovias at discount-13                
Automotive electronics
Rocket PCB stacked any-layer pcb mircovias at discount-14                
Communications
Rocket PCB stacked any-layer pcb mircovias at discount-15                
Energy
Rocket PCB stacked any-layer pcb mircovias at discount-16                
Industrial & Instrumentation
Rocket PCB stacked any-layer pcb mircovias at discount-17                
IOT/Smart Home
Rocket PCB stacked any-layer pcb mircovias at discount-18                
Medical electronics
Rocket PCB stacked any-layer pcb mircovias at discount-19                
Security Industry

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