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Rocket PCB professional wire bonding process surface finished for digital device

Rocket PCB professional wire bonding process surface finished for digital device

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB professional wire bonding process surface finished for digital device
Company Advantages
1. Rocket PCB wire bonding services has been certified in all aspects. They involve electrical safety, hygiene, electromagnetic compatibility, energy efficiency, electric shock, and leakage. It is hard to find any short circuits in this product
2. This product is widely used in the market for its excellent economic value and high cost performance. It takes less time in assembling a circuit as compared to the conventional method
3. The product distinguishes itself from competitors with long-lasting performance and longer service life. Its signal paths are well organized and exposed quite well
4. The quality of this product is up to the international standard. It is the perfect choice for manufacturers of electronic components, instruments, and equipment
5. As we focus on the improvement of the quality, this product has been manufactured with high quality and stable performance. All the components within this product are fixed using solder flux

methods


Rocket PCB professional wire bonding process surface finished for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is the first-choice partner for customers in wire bonding process manufacture industry. printed circuit board industry is produced by our modern production lines and inspected by our experienced technician.
2. Rocket PCB has mature production process, excellent production team and strict quality control system.
3. The improvement of technical power has also promoted the development of Rocket PCB. Cultivated by deep enterprise civilization, Rocket PCB Solution Ltd. is heavily influenced for being a major wire bonding company. Check it!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!