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Rocket PCB printed printed circuit board technology circuit for electronics

Rocket PCB printed printed circuit board technology circuit for electronics

Name:
Thermal management pcb, metal base pcb, MCPCB
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB printed printed circuit board technology circuit for electronics

About our product

To ensure reliability and efficiency of operation, heat must be removed from the power components that generate heat. Thermal management helps to elicit heat from the components of the heating system in a variety of application industries.
Heat Sink PCB provides a path for heat from the heat source to the outside or the inside medium. Heat sink PCBs can usually dissipate heat in three ways: conduction (Heat transfers from one solid to another), convection (Heat transfers from the solid to the moving fluid. For most power or LED applications, it would be transferred to air), radiation (Heat transfers from two objects with different surface temperature through thermal radiation).

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Typical applications


Power applications
  • ◪   Electric power amplifiers

  • ◪   DC, Power control systems

  • ◪   RF and MW

Automotive application
  • ◪   Motor control modules

  • ◪   Electric braking systems

  • ◪   EV power transmission system

  • ◪   High-speed computing

  • ◪   LED lighting systems

  • ◪   Automotive, industrial and consumer goods







Management Solutions


Rocket PCB offers a wide range of thermal management types including vias of farm heatsinks/pallets, heatsink coins, embedded coins, e-coins, Press Fit Coin (PFC), metal in-lay, solder or adhesive attach.  Additionally, Rocket's Thermal Management Solutions include our patented embedded E-Coin technology, heatsink coin attachment and heavy copper. We specialize in RF & MW.

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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

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