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Rocket PCB pcb production pcb for sale

Rocket PCB pcb production pcb for sale

Embedded PCB
Board thickness:
Surface treatment:
Immersion Gold
Embedded thin film resistor, embedded capacitor
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
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Product Information of Rocket PCB pcb production pcb for sale
Product Details
Adhering to the concept of 'details and quality make achievement', Rocket PCB works hard on the following details to make the PCB prototyping more advantageous.Rocket PCB carries out strict quality monitoring and cost control on each production link of PCB prototyping, from raw material purchase, production and processing and finished product delivery to packaging and transportation. This effectively ensures the product has better quality and more favorable price than other products in the industry.
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Enterprise Strength
  • Rocket PCB always focuses on managing the business with attention and providing sincere service. We are dedicated to providing high-quality products and excellent services.
Company Advantages
1. Rocket PCB pcb printed circuit board is produced according to the high packing production standards through the combination of traditional methods and modern advanced packaging and printing technology.
2. The product is tested under the vigilance of our proficient professionals who clearly know quality standards laid down by the industry.
3. Rocket PCB Solution Ltd. provides one-stop sourcing services with wide range of products.
4. pcb production is well produced and packed by Rocket PCB Solution Ltd..

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Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

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In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

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Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

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  ◪   Reduce surface mounting area by embedding chip components (resistors/capacitors)

  ◪   Improve electrical performance by shortening the wiring distance between surface-mounted ICS and embedded components

  ◪   Shorten the space between components and better heat resistance can be achieved by using a connection between the laser through holes and the copper-plated component terminals

Product application

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Consumer electronics
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Automotive electronics
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB covers a wide range of business including manufacture, sales and service which plays an important role in pcb production industry.
2. The factory is located in an area where infrastructure and services are easily accessible. The accessibility of electricity, water, and resources supply, and the convenience of transportation have reduced the time to completion of the project significantly and decreased the required capital expenditure.
3. Rocket PCB Solution Ltd. is willing to contribute to the development of embedded pcb industry. Ask! Rocket PCB Solution Ltd. is confident that your need will be best satisfied. Ask! Satisfying customers with our considerate service and excellent prototype pcb is what Rocket PCB has been striving for. Ask!
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