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Rocket PCB multi-layer pcb technologies industry at discount

Rocket PCB multi-layer pcb technologies industry at discount

Name:
Backplane PCB, high speed backplane
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB multi-layer pcb technologies industry at discount
Company Advantages
1. A good design of pcb technologies is a icing on the cake in Rocket PCB. It offers a simple platform to arrange the electronic components in a compressed way
2. Rocket PCB Solution Ltd. has established a strict quality guarantee system. The product features low electric currents and radiation emission
3. This product is highly regarded among customers, with high durability and high cost performance. The electronic components and their polarities on it are clearly labeled
4. Professionals strictly control quality to ensure that products are always of the highest quality. The product reduces the possibility of loose connections or short circuit
5. Reliable quality and outstanding durability are the competitive advantages of the product. The product is widely applied in consumer electronics

Capabilities involved in PCB backplane design


CCL

Because the thickness of the backplane, size and is not the same as a conventional board, its performance requirements for the CCL is not the same

Thickness

The thickness of the backplane is thicker than that of the conventional board

Size

The size of the backplane is much larger, for production also has this certain impact

Drilling

Due to the increase in thickness and the use of crimp contact, the accuracy of drilling and the ability to copper plating has special requirements

The number of layers

The layer of the backplane also be developed to the high-level number, more than 10 layers of design is also more common.

Layout

Backplane wiring density is relatively small, but there are special requirements for impedance requirements and inner-layer lines.

Surface treatment

Due to the thickness of the backplane, size is relatively large, some surface treatment process is more difficult to achieve

Special process

Due to the characteristics of the backplane itself, the backplane sometimes uses some special processes.



OUR STRENGTHS
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In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger



CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing


FEATURES



  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias









Advanced Product and Technology
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Product Feature
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High-speed Backplanes:

  ◪   Panel sizes up to 54 inches

  ◪   Over 70 layers

  ◪   Blind and back drilled through holes

  ◪   Dual diameter holes

  ◪   Heavy copper layers

  ◪   Connector expertise

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Our Services
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  • 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For Backplane board, will be based on board parameters, normally 15-30 days.

  • Effective and flexible PCB engineering solutions save your cost. We always put the best interests first when providing innovative solutions for manufacturing customers’ products, we are more willing to help customers grow.

  •   Rapid feedback on the layout,build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc.

  •   Strong partnerships with different reputed material suppliers such as Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide range of PCB applications.

  •   Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc.100% outgoing pass rate.

  •   Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.

  •   We will keep secret for customer sale area, design ideas, drawing and all other private information.

  •   Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.




Product Application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB applies the advanced technologies to produce pcb technologies .
2. We wish that our all-round order custom pcb can make customers well worth the money. Get quote!
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: Hans@Rocket-PCB welcome to consult!