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Rocket PCB micro-wave microwave pcb hot-sale instrumentation

Rocket PCB micro-wave microwave pcb hot-sale instrumentation

Name:
RF PCB, microwave PCB, high frequency PCB, high speed PCB
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB micro-wave microwave pcb hot-sale instrumentation


Rocket PCB provides high-frequency microwave printing circuit board of the fast sample production services. Professional production experience for high frequency circuit boards used in power divider, coupling and device, circuit builder, amplifier, dry release, base station 3G antenna. Company year-round stocks domestic and imported high-frequency material (F4B Rogers, TACO, NC, ARLON, TP-2) dielectric constant 22106, etc. Can provide fast sample service and mass production in time to meet your diverse, multi-variety needs.

We have a vibrant, professional and dedicated, experienced, high-quality team on technology, production and management.

Our company has low cost and foreign information technology support and other advantages, after more than 10 years of efforts and repeated combination of resources, the company is casting its own brand with a new face.
”Depends on professional technology and rich experience of high-frequency microwave printed circuit board production to become the domestic 3G/4G equipment top manufacturer.” With high quality, fast delivery, high quality after-sales service and high-level professional ethics win praise from customers
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OUR STRENGTHS
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In Rocket, with advanced production equipment, excellent PCB solutions and complete testing methods, we have specialists working on their particular fields with the thorough mastery of their particular discipline in each of the production facilities. Training, as well as technical exchanges, are held frequently, tackling problems in key technologies and configuring scheme of equipment and allowing professionals to get up to speed on the essential tools that many organizations value today in the manufacturing industry. Thanks to those above, we have greatly improved the strength and won international reputation.


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger



CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing


FEATURES



  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias









Advanced Product and Technology
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Our Services
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  1. 24 hour real-time technical support Quick turn around with 24 hours and instant quote. For Backplane board, will be based on board parameters, normally 15-30 days.

  2. Effective and flexible PCB engineering solutions save your cost. We always put the best interests first when providing innovative solutions for manufacturing customers’ products, we are more willing to help customers grow.

  3. Rapid feedback on the layout,build-up, panels, impedance, material selection, design rules, manufacturability, costs of different solutions, use of micro vias, gold plating, special laminates, etc.

  4. Strong partnerships with different reputed material suppliers such as Rogers, Arlon, Nelco and Taconic can realize a fast service to a wide range of PCB applications.

  5. Dozens of tests such as open/short circuit testing( ET test), AOI, X-ray, impedance testing, solderability testing, thermal shock testing, metallographic micro-slicing analysis, halogen-free testing, etc.100% outgoing pass rate.

  6. Complete services from free DFM, traceable manufacturing to complete after-sales service, on time delivery 99%.

  7. We will keep secret for customer sale area, design ideas, drawing and all other private information.

  8. Flexible payment terms. Samples for 100%TT, mass production payment: 50% advance payment 50% balance should be paid off before loading or accept monthly statement if the order is stable.





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Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, and we will reply to you ASAP. Welcome, what can I help you?
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