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Rocket PCB hot-sale pcb manufacturing process mircovias at discount

Rocket PCB hot-sale pcb manufacturing process mircovias at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB hot-sale pcb manufacturing process mircovias at discount
Product Details
Rocket PCB's PCB prototype is processed based on the latest technology. It has excellent performances in the following details.PCB prototype is in line with the stringent quality standards. The price is more favorable than other products in the industry and the cost performance is relatively high.
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Company Advantages
1. The design of Rocket PCB pcb prototyping is the application of various disciplines. They include mathematics, kinematics, statics, dynamics, mechanical technology of metals and engineering drawing.
2. This product causes only a small amount of noise pollution. It uses a fundamental method to control noise - eliminating friction as much as possible.
3. This product has a unique versatility - it is refined enough to fit for city life, but even in a country house, it still works perfectly against a more rustic backdrop.
4. There is a very broad development prospect of this product owing to these features.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB hot-sale pcb manufacturing process mircovias at discount-1





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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB hot-sale pcb manufacturing process mircovias at discount-3



Anylayer PCB DFM suggestion for layout


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Product FEATURES


Rocket PCB hot-sale pcb manufacturing process mircovias at discount-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


Rocket PCB hot-sale pcb manufacturing process mircovias at discount-7                
Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. has grown into a reliable manufacturer who specializes in the production of pcb prototyping . We are widely accepted in the industry.
2. The cutting-edge technology adopted in pcb manufacturing process helps us win more and more customers.
3. Our aim is to surpass our customers’ expectations every time. We know all about the demands placed on the products’ end uses and we promote our customers’ businesses through innovative product and service solutions. Our business goal is to improve our production efficiency by using new production technologies to reduce emissions and increase recycling. We proactively conduct sustainability practices by investing in new product design, clean technologies, and more efficient processes, we will save money and resources. We are active in business sustainable development. We will uphold business ethics throughout our production, such as reducing water consumption by recycling reusable water.
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