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Rocket PCB heat-resistant IC structure pcb board for base material

Rocket PCB heat-resistant IC structure pcb board for base material

Name:
Ceramic Substrate
Material:
Ceramic
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB heat-resistant IC structure pcb board for base material
Company Advantages
1. Manufactured using premium quality materials and sophisticated technology, Rocket PCB stands for the excellent craftsmanship in the industry. It makes the interconnections less bulky
2. Some of our customers praise that it is very durable and efficient. They have used it for 2 years and it still functions well in heat dissipation. Its signal paths are well organized and exposed quite well
3. Strict quality control process runs through the whole production process and eliminates the possible defects. It is subjected to extreme heat and soldered into place
4. To ensure product quality, the product is produced under the supervision of our experienced quality assurance team. It plays an important role in modern electronic equipment
5. This product is the first choice of our customers, with long service life and practicality.


Rocket PCB is good at aluminium oxide ceramic-based CCL PCB, alumina ceramic PCB, LED ceramic PCB, Al2O3 ceramic PCB, high thermal conduction ceramic PCB, ceramic-based PCB fabrication.

The ceramic PCB relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. It's an indispensable basic material for power module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conductivity, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.


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Product FEATURES


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Ceramics are superior to other printed circuit boards

  ◪   Higher operating temperatures up to 350℃

  ◪   Low expansion coefficient

  ◪   Good thermal performance

  ◪   Superior high-frequency performance

  ◪   Reduce costs for testing, insertion and assembly

  ◪   Smaller package size

  ◪   Sealed packaging with a water absorption rate of 0%



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Almost all technician talent for the industry of IC structure pcb work in our Rocket PCB Solution Ltd..
2. Sustainability is a core element of our company. We have made and strictly follow the product criteria that take into account sustainability aspects across the entire life cycle for the evaluation of products.
Product Message
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