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Rocket PCB free sample any-layer pcb anylayer for wholesale

Rocket PCB free sample any-layer pcb anylayer for wholesale

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
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Quantity Needed:
Pieces
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Product Information of Rocket PCB free sample any-layer pcb anylayer for wholesale
Company Advantages
1. The design style of Rocket PCB any-layer pcb keeps abreast of the popular trends. It takes less time in assembling a circuit as compared to the conventional method
2. This product has great economic benefits and huge market potential. Its signal paths are well organized and exposed quite well
3. This product absorbs moisture and sweats, and has a very high level of softness. It is also hypoallergenic and pesticide-free. It is properly laid out, giving less electronics noise
4. The product has good heat dissipation. Usually constructed from composite metal materials which have a very high thermal conductivity, it features a high rate of heat transfer. The electronic components and their polarities on it are clearly labeled


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB free sample any-layer pcb anylayer for wholesale-1





Rocket PCB free sample any-layer pcb anylayer for wholesale-2
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB free sample any-layer pcb anylayer for wholesale-3



Anylayer PCB DFM suggestion for layout


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Rocket PCB free sample any-layer pcb anylayer for wholesale-5



Product FEATURES


Rocket PCB free sample any-layer pcb anylayer for wholesale-6

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
Rocket PCB free sample any-layer pcb anylayer for wholesale-8                
Automotive electronics
Rocket PCB free sample any-layer pcb anylayer for wholesale-9                
Communications
Rocket PCB free sample any-layer pcb anylayer for wholesale-10                
Energy
Rocket PCB free sample any-layer pcb anylayer for wholesale-11                
Industrial & Instrumentation
Rocket PCB free sample any-layer pcb anylayer for wholesale-12                
IOT/Smart Home
Rocket PCB free sample any-layer pcb anylayer for wholesale-13                
Medical electronics
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Security Industry

Company Features
1. Rocket PCB dedicates to providing exquisite any-layer pcb , further improving the life quality. Our factory has been ISO 9001 certified: an international certification that recognizes the constant improvement of our quality management systems. This allows us to meet the quality requirements of our customers.
2. Rocket PCB Solution Ltd. has state-of-the-art production technology and modern management mode.
3. Our factory has imported a series of advanced production facilities that can ensure constant and steady production. This means that thousands of products can be made in astonishingly short periods of time. We make ourselves comply with the rules and regulations of each country in which we operate. We make our products to meet relevant standards in specific countries.
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