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Rocket PCB finished wire bonding technology bulk fabrication for electronics

Rocket PCB finished wire bonding technology bulk fabrication for electronics

Rocket PCB finished wire bonding technology bulk fabrication for electronics

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB finished wire bonding technology bulk fabrication for electronics
Company Advantages
1. wire bonding technology we quoted are all made of the best semiconductor wire bonding in order to meet the requirements of all walks of life in the world. It takes less time in assembling a circuit as compared to the conventional method
2. All workers of Rocket PCB Solution Ltd. are well trained for manufacturing.
3. This product is not easily pilling or damaged by severe wear. Its textile fibers are treated with an antistatic agent to reduce static electricity and reduce wear between the fibers. It is subjected to extreme heat and soldered into place
4. The strengths of its materials mean this product is tear-proof, will not lose its qualities after washing and can last for years. The product is widely applied in consumer electronics
5. Outstanding mechanical properties of this product is known. With remarkable loading strength and overpressure withstanding ability, it can endure daily heavy use. It is specifically designed to lessen the chances of shorts and wiring issues

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB finished wire bonding technology bulk fabrication for electronics-1


methods


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Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


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Consumer electronics
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Automotive electronics
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Communications
Rocket PCB finished wire bonding technology bulk fabrication for electronics-7                
Energy
Rocket PCB finished wire bonding technology bulk fabrication for electronics-8                
Industrial & Instrumentation
Rocket PCB finished wire bonding technology bulk fabrication for electronics-9                
IOT/Smart Home
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Medical electronics
Rocket PCB finished wire bonding technology bulk fabrication for electronics-11                
Security Industry

Company Features
1. Rocket PCB is a large-scale company that is committed to offering the best wire bonding technology . With advanced technology applied in wire bonding , we take the lead in this industry.
2. Our advanced machine is able to fabricate such wire bonding pcb with features of [拓展关键词/特点].
3. wire bonding process is assembled by our highly skilled professionals. Dedication to customer success is a core value that affects everything we do. We quickly react to customers and their needs and make regular communication with customers, which helps us close gaps between customer expectations and our services.
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!