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Rocket PCB finished printed circuit board industry bulk fabrication for digital device

Rocket PCB finished printed circuit board industry bulk fabrication for digital device

Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
DDU, FOB, CFA, CIF, CPT, EXW
Price
Get Latest Price
Get the latest price
Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB finished printed circuit board industry bulk fabrication for digital device
Product Details
With the pursuit of perfection, Rocket PCB exerts ourselves for well-organized production and high-quality printed circuit board.Under the guidance of market, Rocket PCB constantly strives for innovation. printed circuit board has reliable quality, stable performance, good design, and great practicality.
  • Rocket PCB finished printed circuit board industry bulk fabrication for digital device-PCB prototype
Company Advantages
1. The production of Rocket PCB printed circuit board industry is ensured by cutting-edge technologies.
2. The product is highly hard-wearing. It is made of abrasion-resistant materials that enable it to withstand harsh wearing conditions.
3. Mature technology, standardized production and strict quality management system ensure the quality of printed circuit board industry.

methods

Rocket PCB finished printed circuit board industry bulk fabrication for digital device-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


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Consumer electronics
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Automotive electronics
Rocket PCB finished printed circuit board industry bulk fabrication for digital device-4                
Communications
Rocket PCB finished printed circuit board industry bulk fabrication for digital device-5                
Energy
Rocket PCB finished printed circuit board industry bulk fabrication for digital device-6                
Industrial & Instrumentation
Rocket PCB finished printed circuit board industry bulk fabrication for digital device-7                
IOT/Smart Home
Rocket PCB finished printed circuit board industry bulk fabrication for digital device-8                
Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. has been engaged in the production of printed circuit board industry since its establishment.
2. Rocket PCB Solution Ltd. is especially technologically leading.
3. Our goal is to provide top-quality manufacturing solutions that make customers' products stand out with style and be remembered. Our goal is to maximize the value of our company. Therefore, we will continue to work to create valuable products that will help create a brighter future for society. Check now! Sustainability will remain as our long-term goal. We will spare no effort to upgrade the production model or even restructure in an effort to production efficiency. Our mission is to provide the best product solutions by exceeding customer's expectations on product and service. We will take the clients' requirements seriously.
Product Message
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Thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply to you ASAP. Skype account: hans.hu@rocket-pcb.com welcome to consult!