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Rocket PCB fabrication wire bonding surface finished for automotive

Rocket PCB fabrication wire bonding surface finished for automotive

Name:
wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
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Quantity Needed:
Pieces
E-mail:
Product Information of Rocket PCB fabrication wire bonding surface finished for automotive
Company Advantages
1. Rocket PCB is designed and manufactured by a team of skilled employees. It is hard to find any short circuits in this product
2. Rocket PCB's factory has advanced production management experience and sound quality control system. Its simple design makes it easier for users to maintain and manipulate
3. The product has excellent heat dissipation effect. The surface area is maximized to contact with the cooling medium surrounding it, such as the air and the cooling liquid. The product allows the installation and repair process to be convenient

methods


Rocket PCB fabrication wire bonding surface finished for automotive-1

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating

Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



Product application


Rocket PCB fabrication wire bonding surface finished for automotive-2                
Consumer electronics
Rocket PCB fabrication wire bonding surface finished for automotive-3                
Automotive electronics
Rocket PCB fabrication wire bonding surface finished for automotive-4                
Communications
Rocket PCB fabrication wire bonding surface finished for automotive-5                
Energy
Rocket PCB fabrication wire bonding surface finished for automotive-6                
Industrial & Instrumentation
Rocket PCB fabrication wire bonding surface finished for automotive-7                
IOT/Smart Home
Rocket PCB fabrication wire bonding surface finished for automotive-8                
Medical electronics
Rocket PCB fabrication wire bonding surface finished for automotive-9                
Security Industry

Company Features
1. Rocket PCB Solution Ltd. provides upscale products in wire bonding field. We possess a wide range of manufacturing facilities, covering advanced manufacturing and testing machines. These machines run in an efficient manner and enable us to meet customers' requirements in a short period of time.
2. Our company has experienced project management. They can quickly identify opportunities for cost-saving, de-risking and accelerating the introduction of technology and improved processes into customers' businesses.
3. Our plant is situated in a satisfactory location where is near to the airports and ports within an hour. This has helped minimized our transportation costs and risks in shipping. To be a leading simple pcb board supplier, Rocket PCB constantly strives for perfection to attract more customers. Get quote!
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