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Rocket PCB fabrication wire bonding process surface finished for electronics

Rocket PCB fabrication wire bonding process surface finished for electronics

Rocket PCB fabrication wire bonding process surface finished for electronics

Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term:
5-25 working days
Price
Get Latest Price
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Quantity Needed:
Pieces
E-mail:
Product Details
Rocket PCB's PCB maker is exquisite in details.Good materials, advanced production technology, and fine manufacturing techniques are used in the production of PCB maker. It is of fine workmanship and good quality and is well sold in the domestic market.
Company Advantages
1. The manufacturing of Rocket PCB wire bonding process includes a wide range of procedures. They are fabric sourcing, printing, sewing, woven tags, swing tags, quality control, and so forth.
2. A series of strict pre-delivery testing is carried out to eliminate the defect product. The testing is strictly conducted by our testing personnel and thus the quality of this product can be guaranteed.
3. Some of our customers who live in a remote area where electricity is expensive to afford said this product brings much convenience to their life.
4. The product is ultra clean and aesthetic, making itself equally suited for daily commutes and extended travel.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.


Gold wire bonding

Rocket PCB fabrication wire bonding process surface finished for electronics-1


methods


Rocket PCB fabrication wire bonding process surface finished for electronics-2

Common PCB plating and wire bonding methods include


  ◪   Aluminum Wedge Wire Bonding and ENIG Plating

  ◪   Gold Ball Wire Bonding and soft gold plating

  ◪   Gold Ball Wire Bonding with ENEPEG plating



Wire bonding capabilities


Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.


Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



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Product application


Rocket PCB fabrication wire bonding process surface finished for electronics-4                
Consumer electronics
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Automotive electronics
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Communications
Rocket PCB fabrication wire bonding process surface finished for electronics-7                
Energy
Rocket PCB fabrication wire bonding process surface finished for electronics-8                
Industrial & Instrumentation
Rocket PCB fabrication wire bonding process surface finished for electronics-9                
IOT/Smart Home
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Medical electronics
Rocket PCB fabrication wire bonding process surface finished for electronics-11                
Security Industry

Company Features
1. With production scale at the leading position in China, Rocket PCB Solution Ltd. is renowned for excellence in designing and manufacturing semiconductor wire bonding .
2. Our company has a group of skilled employees. They have the appropriate skills to improve production, including communication, computer, planning, analytical and problem-solving skills.
3. Rocket PCB Solution Ltd. will make every effort to produce the most satisfying wire bonding process . Get quote! Rocket PCB Solution Ltd. will improve the production and processing technology of wire bonding products. Get quote! Rocket PCB believes that through unremitting efforts to realize the dream of simple pcb board will finally work out. Get quote!
Product Message
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Dear customer, thank you for your attention. Please kindly describe your question first, or please send your inquiry to our email sales@rocket-pcb.com, we will reply you ASAP. Our Skype account Hans@Rocket-PCB is also online at any time, welcome to consult!